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VOLUME 34 - NUMBER 8 Product Preview:


NEPCON Asia


THE GLOBAL HI-TECH ELECTRONICS PUBLICATION Inaugurates Fremont Tech Center


Fremont, CA — Anda Technologies USA has inaugurated a technology center in Fremont, California, cele- brating the grand opening event with a ribbon cutting ceremony, a tour of the facility and lunch for members of the press and industry professionals from the surrounding area.


Fuji unveils a new smart factory platform, NXTR, which can eliminate defects, operators and machine downtime. Product Pre- views begin on… Page 62


East/West Mfg


Focuses on Quality and Flexibility


Headquartered in Austin, Texas, East/West Mfg. part- ners with OEMs to provide everything from prototypes to high-volume production. EMS section begins on….


Page 18 This Month's Focus:


PCB and Assembly


Company representatives from Anda Technologies USA cut a ceremonial ribbon, inaugurating Anda’s technology center.


Laser Soldering with Compression for Fine-Pitch, Thin Dice


TopLine discusses the ramifi- cations of a global shortage of critical electronic components; IMDES focuses on mitigating tombstones during reflow sol- dering; XJTAG offers a method of testing the latest DDR memory devices. Special Features begin on…


Page 52


Dover, NH — A novel laser selective reflow soldering system has been de- veloped by Laserssel. The company, whose U.S. headquarters are in Dover, New Hampshire, is offering Laser Selective Reflow (LSR), which delivers a uniform, defocused laser beam over a specifically tailored area on a PCB. The company’s soldering meth -


od ology was successfully tested and proven in forming robust, high-yield and cost-effective electronic intercon- nects in the semiconductor and sur- face mount industries. This was ac- complished in an inline, mass manu- facturing environment.


The application consisted of a


2.8 mil (70 µm) thick die with a 1.6 mil (40 µm) copper pillar and 1 mil (25 µm) SnAg cap. The PCB thick- ness was 13.8 mil (350 µm) ±0.8 mil (20 µm) and a total system thickness of ±18 mil (± 460 µm). The concern with developing a soldering process for this application and similar ones is the proper coalescence of the com- ponent and pad terminations. Warpage, dimensional varia-


tions and proper contact, in conjunc- tion with soldering parameters are critical in achieving reliable, consis- tent interconnects within a robust soldering process.


Laser Reflow with Compression Laserssel has developed a meth -


od to ensure a repeatable soldering process using its novel area laser re- flow technology in conjunction with compression to enable the end user to effectively produce reliable, high- yield interconnects. In this case study, two methods were developed


Continued on page 8 Anda’s technology center in-


cludes a variety of innovative tech- nologies and solutions to help cus- tomers solve difficult challenges. Its systems include high-precision coat- ing and dispensing valves, linear mo- tors, servo linear guides, polymer mineral casting, and optical assem-


bly equipment. The center also in- cludes technology to fabricate high- precision dispensers, coating ma- chines, UV and thermal curing ovens and plasma treatment equipment. The new tech center offers in-


creased square footage, containing a demo room with state-of-the-art fluid dispensing, plasma treatment and conformal coating equipment solu- tions, as well as the latest fluid appli- cation and custom design manufactur- ing with hands-on training and inter- active demonstrations for customers.


Five Key Technologies During the event, company rep-


resentatives focused on Anda’s five newest technologies: plasma treat- ment, conformal coating, multifunc- tional fluid dispensing, robotics, and


Continued on page 8


Lawrence, KS — Imagine printing electronic devices using a simple inkjet printer, or even painting a so- lar panel onto the wall of a building. Such technology would slash the cost of manufacturing electronic devices and enable new ways to integrate them into our everyday lives. Over the last two decades, a


Breakthrough Material Could Lead to Cheaper Electronics


type of material called organic semi- conductors, made out of molecules or polymers, has been developed for such purposes. But some properties of these materials pose a major hur- dle that limits their widespread use. “In these materials, an electron


is usually bound to its counterpart, a missing electron called a ‘hole,’ and can’t move freely,” says Wai-Lun Chan, associate professor of physics and astronomy at the University of Kansas (KU). “So-called ‘free elec- trons,’ which wander freely in the material and conduct electricity, are rare and can’t be generated readily by light absorption. This impedes the use of these organic materials in ap- plications like solar panels because panels built with these materials of- ten have poor performance.”


Continued on page 6 Anda Technologies USA August, 2019


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