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www.us- tech.com


August, 2019 Indium Intros Non-Silicone-Based TIM


Clinton, NY — Indium Corporation has added to its line of thermal interface materials (TIMs) with the introduction of HSMF-OS, a non-silicone-based metal/polymer material designed for burn-in and test applications. HSMF-OS is designed for high insertion capa-


bility. Its high tensile strength and soft compliant polymer backing allow it to survive multiple inser- tions. HSMF-OS has been tested to withstand over 5,000 insertion cycles without any loss of perform- ance.


One of the challenges associated with a burn-


in TIM is the attachment method. HSMF-OS has inherent adhesive properties on one side that allow for hand placement, removing the need for addi- tional steps and fixtures, without compromising thermal performance. The opposite side is alu-


HSMF-OS metal/polymer thermal interface material.


minum and it will not mark or stain the DUT (device under test). HSMF-OS offers consistently good performance without phase change. Indium Corporation develops and manufac-


tures materials used primarily in the electronics assembly industry. Products manufactured by Indium solder paste and powders, metals, solar assembly materials, solders, flux and epoxies, inor- ganic compounds, thermal interface materials, NanoFoil®, reclaim and recycle, and thin-film materials. The company has manufacturing capabilities, technical support, sales offices, and representa-


tives worldwide. Contact: Indium Corp., 34 Robinson Road,


Clinton, NY 13323 % 315-381-7524 E-mail: abrown@indium.com Web: www.indium.com


See at NEPCON Asia, Booth 1L25


Eutect Presents New SWF Piston Soldering Module


Dusslingen, Germany — Eutect GmbH has patented its Sensitive Wire Feeder (SWF), reportedly, the only intelligent wire feeder world- wide. It can be used in combination with a laser, piston or induction sys- tem for soldering. As part of its con- tinuous product development, Eutect has presented a new piston soldering system in combination with the SWF. The new KL module is force,


wire quantity and speed-controlled with 100 percent traceability. The new module is equipped with fully automated changing of the soldering tip and an integrated nitrogen gas supply. With the help of intelligent sensors, the operator is informed when the wire is tending towards the end in the feeder. There, the system has another 1.6 in. (40 mm) of wire in reserve after the signal, in order to be able to complete both the current solder and the process. The SWF can also be freely inte-


grated into the machine room in the latest stage of its development. The SWF KL system adapter, which can be adjusted for optimal soldering results, allows for almost completely free, solid and reproducible arrange- ment of the wire feeders and the sol- dering piston kinematics. The new SWF-KL module can


also be equipped with an extraction system. Depending on the overall automation solution, the product to be soldered and the process flow, the extraction system is integrated and minimizes contamination in the sys- tem and in the installed components. The freely adjustable speeds and


wait and dwell times in the SWF mod- ule and in the motorized and spring- loaded piston in-feed allows for a max- imized process window. The piston sol- dering itself can also be adjusted for the production conditions and specifi- cations. The piston soldering service life can be maximized through user- selectable standby temperatures and


application-specific settings. Contact: Eutect GmbH,


See at NEPCON Asia, Booth 1K55


Filsenbergstrasse 10, 72144 Dusslingen, Germany % +49-0-7072- 92890-0 E-mail: info@eutect.de Web: www.eutect.de


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