August, 2019
www.us-tech.com
VJE Debuts Improved Counting System and Rework Platform
Chelmsford, MA — VJ Electronix is demonstrating the latest enhance-
AccuCount Technology. The XQIII does not require libraries as it auto- matically recognizes components. According to the company, the XQIII is the fastest component counter available on the market with 10 sec- onds per reel count time. The XQII is designed to be used standalone or integrates with full material han- dling automation and MES systems. The Summit 1800i is an improved version of the popular rework system. VJE has maintained all the benefits of high-efficiency con-
vection heating and the renowned 1- 2-3-Go interface, coupled with updat- ed technology for greater reliability and an improved price point. Further refinements enhance the system’s performance with ultra-small compo- nents like 01005s (0402 metric), while maintaining its capabilities with large boards, oversized CPU sockets, connectors and large BGAs up to 3.9 x 3.9 in. (100 x 100 mm). VJE X-ray inspection and rework systems boost productivity and maximize production uptime.
Technologies offered in BGA rework systems include convection, conduc- tion and infrared for maximum heat transfer for rework applications as small as micro passive 01005 (0402 metric) to thermally challenging CCGA rework. Contact: VJ Electronix, Inc., 19 Alpha Road, Chelmsford, MA 01824 % 978-486-4777 Web:
https://vjt.com/industry/electronics/
See at NEPCON Asia, Booth 1J45
Summit 1800i rework system.
ments to its rework and X-ray prod- uct lines at NEPCON Asia 2019. VJ Electronix is introducing the XQuikIII component counter with
DuPont Intros Cleaning Chemistries for Semicon Fabrication
Hayward, CA — DuPont Electronics & Imaging has introduced three new chemistries to support advanced semiconductor fabrication: DuPont™ EKC™ PCMP2110 cleaner, EKC™ PCMP3210 cleaner and EKC™ 590 CuSolve™ remover.
DuPont’s EKC Technology group develops materials for preci- sion cleaning and surface prepara- tion in semiconductor fabrication processes, including front- and back- end wafer processes, packaging and assembly. These new expansions to the EKC cleans portfolio address a number of complex challenges associ- ated with advanced technology node processes, where the number of process steps has increased. EKC PCMP2110 and EKC PCMP3210 are new chemistries for post-chemical mechanical planarization (CMP) cleaning, whereas EKC 590 CuSolve is a new offering for post-etch residue removal.
The most recent of these new products, EKC PCMP2110 is formu- lated for emerging logic and memory CMP processes that use ceria-based slurries. At advanced nodes, cleaning after ceria CMP is challenging, due to increasingly higher removal rate requirements and the small ceria particle size.
EKC PCMP2110 provides bet- ter post-CMP cleaning performance than specialized cleans used in the marketplace today, while also mak- ing it possible to eliminate post wet bench commodity clean steps, such as sulfuric peroxide mixture (SPM) or sulfuric acid. Contact: E.I. du Pont de Nemours and Company, Inc., 974 Centre Road, Wilmington, DE 19805 % 302-509-1859
E-mail:
rebekah.l.lazar@
dupont.com Web:
www.dupont.com
Thrives on a Challenge. Loves Variety. The ultimate multi-process inspector for paramount speed, accuracy and ease of use.
Page 69
AOI
SPI
CMM
SQ3000™ All-in-One Solution Loaded with Powerful Tools that cover Inspection and Measurement for AOI, SPI and CMM.
Fast and highly accurate, repeatable and reproducible measurements for metrology applications in the manufacturing of a wide variety of products such as PCBs, semiconductors and consumer electronics.
The SQ3000™ offers unmatched accuracy with the revolutionary Multi-Reflection Suppression (MRS) technology by meticulously identifying and rejecting reflections caused by shiny components. Effective suppression of multiple reflections is critical for accurate measurement, making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.
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