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www.us- tech.com


August, 2019


Anda Inaugurates Fremont Tech Center


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vertical curing. The AP-3P selective atmospheric plasma treatment sys- tem can accommodate dual nozzles on the top and bottom, operated si- multaneously and inline with fluid dispensing or selective conformal coating equipment. Atmospheric plasma treatment


is a unique technology for surface treatment in electronics assembly. It is useful for applications that include nano-cleaning, removal of organic contaminants, surface activation and modification, surface ablation and etching, creating hydrophobic or hy- drophilic surfaces, passivation, bio- compatibility, and plasma coating of nearly any material — composites, plastics, metals, glass, cardboard, and textiles. The iCoat-5 series high-precision


selective conformal coating machine offers single- or dual-head configura- tions. Single-head, three-nozzle struc- ture with four-axis movement and 35° tilt is the most flexible workcell for the machine to cater to the most demand- ing coating applications. The iJet-7 series multifunction-


al fluid dispensing systems offer both precision and flexibility with a com- bination of electronic dispensing head and control software. This ma- chine is capable of dispensing adhe- sives and sealants, offers high accu- racy for the x, y and z axes, closed- loop technical control to ensure dis- pensing volume consistency, a built- in CCD vision system, automatic nozzle cleaning, a large work area,


and a flexible design that is easy to upgrade. The system has repeatabil- ity accuracy of ±0.0004 in. (±0.01 mm), rigid welded steel frame con- struction, and linear speeds of up to 31.5 in./s (800 mm/s). Anda’s ADS series of robotic


arms are easy to operate and auto- mate. All three systems, the ADS260, ADS400 and ADS600 offer collabora- tive abilities that make them excel- lent along the production line. These systems are suitable for medical equipment, semiconductors, telecom- munications, and solar applications, including assembly, handling, sort- ing, laminating, coating, dispensing, and curing. The VCO series vertical curing


oven is designed to increase productiv- ity, improve quality and reduce coasts with vertical-format curing solutions. The VCO-70 works inline, offering ver- tical automation for curing processes. Inline automation increases productiv- ity by eliminating the labor needed to load and unload batch ovens. The oven can process up to 70


assemblies simultaneously and has a modular design for easy mainte- nance, simple heater replacement, thermal runaway protection, and eight recirculating hot air zones with PID closed-loop control for uniform temperature. Contact: Anda Technologies


USA, Inc., 47639 Lakeview Boulevard, Fremont, CA 94538 % 509-385-8765 fax: 844-546-3195 E-mail: atsoi@anda.us Web: www.anda.us r


Laser Soldering with Compression for Fine-Pitch, Thin Dice


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to characterize the impact of compres- sion on yield. The dimensions of the PCB were 9.45 x 3.74 in. (240 x 95 mm), with a thickness of 13.8 mil (350 µm), 70 dice, and a die array of 5 x 14. The die dimensions were 0.28 x


0.19 in. (7.1 x 4.8 mm), with a thick- ness of 2.8 mil (70 µm), minimum pitch of 5.9 mil (150 µm), bump size and height of 2.6 mil (65 µm), and a bump count of 748. The soldering process


was developed to solder 30 dice simultaneously using the area laser. The typical area laser soldering process consists of 1 to 10 seconds ex- posure time to the defined area. This application re- quires three distinct areas to be soldered. Total process time for


this application was approxi- mately 24 seconds. The sepa- rate soldering processes were developed. One used compressive force on the 30 dice, while the other soldering process did not. The com- pressive force was accomplished us- ing a controlled quartz plate incident on the defined soldering area. Given the dimensions of the die


Illustration of compressive force applied to die.


opens due to die warpage. In summa- ry, for specific applications, the use of compression enables the end use to eliminate die warpage, resulting in a robust, repeatable and high-yielding soldering process. Contact: Laserssel, 49 High


and the PCB, the maximum devia- tion is less than 0.6 mil (15 µm) in- clusive of any die warpage to develop consistent interconnects. The results


Ridge, Dover, New Hampshire, 03820 % 603-828-2289 E-mail: barbini@laserssel.com Web: www.laserssel.com r


conclusively show the benefit of com- pressive force on the system height after soldering. Without compressive force, the maximum height deviation was 1.1 mil (28 µm) across six dice. With compressive force, the maxi- mum height deviation was 0.4 in. (10 µm) across six dice. The impact of the 1.1 mil (28 µm) system height devia- tion is a widespread occurrence of


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