March, 2015
www.us-
tech.com
Page 83
Techcon Systems: Benchtop Robots and Free Application Testing
Garden Grove, CA — Techcon Sys - tems, a product group of OK Inter - national and a provider of fluid dis- pensing systems and products, is showcasing the TSR2000 Bench Top Robot and TS9200D Jet Tech Valve.
action producing hundreds of precise droplets in less than one second. The main feature of the valve is a single, easily replaceable diaphragm to eliminate dynamic fluid seals found in other jet valves. No longer is it necessary to disassemble, clean and replace worn seals, which translates into saving time and money. The diaphragm also allows fast cycle rates because of its very small mass. Also at the show, the TSR2000 Bench Top Robot Series is suitable for
a wide range of fluid dispensing appli- cations, from inline to batch. The ver- satile TSR2000 dispensing platforms deliver consistent, high-performance dispensing results at an affordable price. The TSR2000 Series is excellent for dispensing dots of solder paste, form-in-place gaskets, filling, potting, encapsulation, bonding, coating and many more. The easy-to-program robot uses dedicated fluid dispensing software, eliminating the need for complex robot language programming.
With fully integrated positioning and fluid dispensing functions, the system is compatible with all Techcon Systems syringes, valves and jet dis- pensing systems. Techcon also will display a wide array of fluid dispens- ing components. Contact: Techcon Systems,
12151 Monarch St., Garden Grove, CA 92841 % 714-230-2398 Web:
www.techconsystems.com
See at NEPCON China Booth #B-1G26.
TAKAYA Think Quality - Think Takaya TAKAYA introduced the world to Flying Probe Test and became the
TS9200D Jet Tech dispensing system.
In addition, the company will
present information on its free appli- cation testing service, which is designed to help customers select the right dispensing equipment. The Techcon Application Lab is equipped with a full range of dispensing equip- ment along with complete laboratory apparatus to specifically develop and reproduce dispensing processes. The TS9200D Jet Tech is a non-
contact dispense valve capable of jet- ting fluid viscosities up to 400,000 Cps. Jet Tech offers a fast jetting
The Benefits of Soldering with Vacuum Profiles
Continued from previous page
components or solder splashing, it should be possible to profile a pres- sure curve in the same manner as a temperature profile. The use of dif- ferent aperture geometries or vari- ously coated stencils won't necessari- ly result in significant differences during vacuum soldering. Any theory of outgassing ducts cannot be con- firmed in this case, since they disap- pear in the preheating zone. To a much greater extent, partitioning of a large ground pad can have a posi- tive effect on wet paste print charac- teristics and wet paste print stabili- ty, and can lead to better soldering results. No single vacuum pressure value can be specified which will always yield the best possible results. Depending on the wet paste layer thickness, the selected solder paste, and the stencil aperture, results with less than 2 percent sol- der void content can be attained by applying vacuum pressure values ranging from 10 to 100mbar. Contact: Rehm Thermal Systems
GmbH, Leinenstrasse 7, 89143 Blaudeuren-Seissen, Germany; Web:
www.rehm-group.com.r
APT-9411CE
APT-94XX Family Industry Standard for Electronics Manufactures
APT-9411SL APT-1400F NowTAKAYA sets a NEW
standard in high performance with the introduction of its Advanced Multi-Function Flying Probe System, the NEW APT-1400F.
APT-1400F
worldwide standard by consistently providing the best performance, reliability, and local support to meet the demanding and varying requirements of electronics manufacturers.
APT-9600CE
Think Quality - Think Takaya TEXMAC, Inc.
3001 Stafford Drive. Charlotte, NC. 28208 Ph: 704-394-0314
www.texmac.com
NEW!
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104