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Page 46 Continued from page 25


paste being deposited on each pad of a PCB is also being checked. The SPI


www.us- tech.com Forward-Looking Manufacturing Decisions


system provides instantaneous feed- back to line operators regarding any deviations of the printing process. It


ensures that when a part is placed on a PCB, the correct amount of solder paste will also be in place to form a


positioning accuracy. The Juki ma- chines are also equipped with feeder trolley carts that allow for quick


WE PACK EFFICIENCY INTO A DESIGN THAT IS


MORE COMPACT THAN EVER.


March, 2015


The company’s two automated x-ray (AXI) systems from ViTrox Technologies.


GAMMA 263 S


The Gamma 263 S delivers efficiency in an


impressively compact design for fully automatic crimping. Sturdy and reliable, this fully


automatic crimping machine meets the needs of your industry with speed and great precision. As the global market leader, Komax Wire offers you complete product lines for efficient


wire processing. Increase your edge every day – it will pay off in the future, too.


reliable solder joint after reflow; if not, a circuit board is pulled offline for paste removal cleaning, and cor- rections/adjustments are made to the screen printer. Such control of the soldering process is critical when building highly complex products that use packaged devices and com- ponents, such as high-density BGAs, µBGAs, package-on-package (PoP), QFNs, LGAs, and 01005 de- vices, to avoid assemblies go- ing offline and requiring re- work due to poor solder joints.


Automated Placement Machines


Once a PCB passes komaxwire.com


through the SPI system, all devices are placed using a Ju- ki inline system. JEMS has four product lines with a total of 12 machines. The capabili- ties provided by the new placement systems (rather than used equipment) allows JEMS to confidently place de- vices and components on a PCB at production speeds and with ±0.03mm


1 13.02.15 11:06


product-to-product changeovers. To guarantee that the correct parts are loaded on the respective feeders at initial feeder setup, JEMS performs an automated offline verification of all feeders on each cart. Once a trol- ley cart is inserted into an SPI ma- chine, a validation program through Cogiscan in conjunction with Juki ensures


that the correct


Nordson YESTECH’s advanced 5-megapixel color camera imaging


technology offers high-speed PCB inspec- tion with exceptional defect coverage.


component/feeder is in the proper lo- cation for the PCBA placement pro- gram.


Another critical in-process Providing Specialized Coating Services since 1996


Protect your PCBs from damage and secure your sensitive designs with the experts at Specialized Coating Services. We offer contract conformal coating and encapsulating (potting) of printed circuit boards for aerospace, medical military and industrial applications.


IONIC TESTING


POTTING / ENCAPSULATING SPRAYING PARYLENE


PLASMA TREATMENT UV COATING / CURING


CROSS SECTIONING IONIC TESTING SUB-ASSEMBLY INSPECTION UNDERFILLING


check at JEMS employs the compa- ny’s automated-optical-inspection (AOI) systems. An AOI system is lo- cated on each of the assembly lines and it completes a 100-percent in- spection of every assembled PCB. Nordson YESTECH’s advanced 5- megapixel color camera imaging technology offers high-speed PCB in- spection with exceptional defect cov- erage. The FX Series AOI systems in-


spect solder joints, lead banks, and verify correct part values and place- ment, enabling JEMS to improve quality and increase throughput. Programming the system is fast and intuitive, and operators typically re- quire less than 30 minutes to create a complete inspection program, in- cluding solder inspection.


SPRAYING AS 9100 POTTING PARYLENE FENCE AND FILL


42680 Christy St., Fremont, CA, 94538 T: 510.226.8700 F: 510.226.8742 www.speccoat.com||| ISO 9001:2008


ANSI / ESD S 20.20 ITAR REGISTERED


Automated 3D X-ray Inspection JEMS also performs automated


3D x-ray inspections as part of its in- house process control. Since AOI sys- tems cannot check what they cannot see, x-ray technology is used to check such hidden details as solder joints. X-ray inspections are performed on 100 percent of the products assem-


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