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Mobiles: Qualcomm’s CMOS could kick IQE’S GaAs


QUALCOMM TECHNOLOGIES, INC. has introduced the Qualcomm silicon CMOS nbased RF360 Front End Solution.


This is a system-level solution that addresses cellular radio frequency band fragmentation and enables for the first time a single, global 4G LTE design for mobile devices.


Band fragmentation is the biggest obstacle to designing global LTE devices, with 40 cellular radio bands worldwide.


The Qualcomm RF front end solution comprises a family of chips designed to mitigate this problem while improving RF performance and helping OEMs more easily develop multiband, multimode mobile devices supporting all seven cellular modes, including LTE-FDD, LTE- TDD, WCDMA, EV-DO, CDMA 1x, TD- SCDMA and GSM/EDGE.


Qualcomm says its RF front end solution includes the industry’s first envelope power tracker for 3G/4G LTE mobile devices, a dynamic antenna matching tuner, an integrated power amplifier- antenna switch, and an innovative 3D-RF packaging solution incorporating key front end components.


Earlier this year, UK based firm Nujira announced its development of silicon based CMOS power amplifiers which also use envelope tracking (see page 10 for details). The firm says these devices boost the linearity, efficiency and output power for CMOS PAs beyond the performance of gallium arsenide power amplifiers (PAs).


The announcement from Qualcomm may well have impacted the share price of compound semiconductor wafer manufacturer IQE. It fell over 13 percent in a day. IQE manufactures gallium arsenide


OPEL financing in motion


Concentrating PV developer OPEL Technologies has successfully completed a $7.2 million private placement which was oversubscribed from the previously announced $5.5 million. The financing consisted of 14,400,000 Units at a price of C$0.50 per unit.


Each unit comprises one common share and one common share purchase warrant. One full warrant allows the holder to acquire one common share of OPEL at an exercise price of C$0.75 per share until February 14th, 2015.


The private placement was conditionally accepted by the TSX Venture Exchange. The securities issued pursuant to the private placement will be subject to a hold period which expires on June 15th, 2013.


The company paid cash commissions of 7 percent of the funds raised and issued a number of broker warrants equal to 10 percent of the units raised. Each broker warrant allows the holder to acquire one common share of OPEL at a price of C$0.50 until February 14th, 2016. The financing was provided by IBK Capital. IBK has a long-standing history of supporting OPEL and its business. This funding will provide the firm with the capital required to complete a $1.3 million equipment acquisition, fund ODIS’s internal and third party development efforts, general administrative expenses and working capital.


With the capital in place, OPEL is in a position to aggressively continue development work towards its previously announced milestones and its strategy of the monetisation of the POET Technology.


March 2013 www.compoundsemiconductor.net 9


wafers used to make chips in next generation mobiles.


The Qualcomm RF360 solution is designed to work seamlessly, reduce power consumption and improve radio performance while reducing the RF front end footprint inside of a smartphone by up to 50 percent compared to the current generation of devices.


The solution reduces design complexity and development costs, allowing OEM customers to develop new multiband, multimode LTE products faster and more efficiently.


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