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news digest ♦ Equipment and Materials


The AIX G5+ is designed to handle five 200 mm wafers per production run providing high throughput and high yield growth of GaN devices on large area substrates.


New shares from Aixtron stock option program not


entitled to dividend The global provider of deposition equipment to the semiconductor industry says it has a number of stock option programs in place


Aixtron SE stock option programs grant employees the right to purchase Aixtron shares under certain conditions.


Under the terms of the stock option plan 2007, stock options can currently be exercised. New shares resulting from exercised options are not entitled to a dividend for fiscal year 2012 and will therefore be traded on the Frankfurt Stock Exchange under the separate ISIN DE000A1TNVU3 until and including the day of the Annual General Meeting 2013 on May 23rd, 2013.


Aixtron’s Executive and Supervisory Boards will propose to the shareholders’ meeting that the 2012 loss of EUR -33.2m should be carried forward to new account.


EV Group expands Covalent Bonding Technologies for III- Vs


The firm’s new solutions will enable covalent combinations of compound semiconductors, other engineered substrates and heterogeneous materials integration for applications such as high mobility transistors and novel RF devices


nanotechnology and semiconductor markets, is developing equipment and process technology to enable covalent bonds at room temperature.


This breakthrough technology will be available on a new equipment platform, called EVG580 ComBond. It will include process modules that are designed to perform surface preparation processes on both semiconductor materials and metals.


EVG built on its decades of experience with plasma activated wafer bonding to create a novel process through which the treated surfaces form strong bonds at room temperature instantaneously without the need for annealing.


“In response to market needs for more sophisticated integration processes for combining materials with different coefficients of thermal expansion, we have developed a revolutionary process technology that enables the formation of bond interfaces between heterogeneous materials at room temperature,” states


124 www.compoundsemiconductor.net March 2013


Winner of the CS Industry 2013 Metrology, Test and Measurement Award : Jordan Valley for its QC3 X-ray diffractometer


Markus Wimplinger, corporate technology development and IP director for EV Group.


“Our unparalleled expertise in wafer bonding process technology will allow us to provide different variants of the new process according to the requirements of different substrate materials and applications.”


EV Group’s new process solutions will enable covalent combinations of compound semiconductors, other engineered substrates and heterogeneous materials integration for applications such as silicon photonics, high mobility transistors, high-performance/low-power logic devices and novel RF devices.


Equipment systems based on a 200mm modular platform, tailored for the specific needs of the new processes, will be available in 2013.


Jordan Valley`s X-ray tool scoops CS Industry


Metrology Tool Award 2013 The company’s QC3 diffractometer is suited for analysing III-V semiconductor and nitride based LEDs. The production worthy system can accommodate up to 20 wafers in a single measurement process


Jordan Valley Semiconductor has announced that its QC3 diffractometer is the winner of the CS Industry 2013 Metrology, Test and Measurement award.


“The QC3 High-Resolution X-Ray Diffractometer is a true leapfrog technology over the existing X-ray technology within the compound semiconductor,” says Paul Ryan, Corporate VP and UK site manager.


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