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LEDs ♦ news digest


Less than a month ago, Holger Jürgensen (deputy chairman of the supervisory board) and Karl-Hermann Kuklies (ordinary member of the supervisory board) of Aixtron, both resigned.


The firm has also recently had a round of redundancies.


Now, Aixtron SE has announced that Paul Hyland, President and CEO, will leave the company by mutual agreement with effect as of February 28th, 2013, for personal reasons.


SETi UVTOP UVC and UVB LEDs now available in SMD format


The firm has revealed a new line of surface mount devices for high-volume cost sensitive markets


Paul Hyland, President and CEO of Aixtron SE


The Supervisory Board has appointed Martin Goetzeler (50), an internationally experienced top manager and industry expert, as Hyland’s successor. Goetzeler will join the company on March 1st, 2013.


Within the Executive Board, he will be responsible for the areas strategy, production, purchasing and logistics, investor relations and group communication.


Before his appointment Goetzeler served on the executive board of Siemens’ subsidiary Osram and also held various international leadership positions within the Siemens group. He is an acknowledged expert in the LED and lighting industry.


For many years, Martin Goetzeler served as President of the European Technology Platform Photonics21, which, among other things, advises the European Commission in determining major strategic research in the area of photonics.


His extensive experience in the target markets of Aixtron will further strengthen Aixtron‘s technology leading position in a period of considerable market change. Goetzeler says, “I am looking forward to the task of leading Aixtron as a leading provider of semiconductor technology production solutions along the way towards industrial mass production.”


He adds, “We have the opportunity to address some of the current social megatrends such as energy efficiency and intelligent networking, which are dominated by LEDs, OLEDs and power electronics. There is substantial growth potential for Aixtron in all of these areas.”


Hyland comments, “I am very pleased that I had the opportunity to participate in Aixtron’s route to becoming a globally acknowledged leading technology company. I am pleased to be able to hand over the CEO role to Mr. Goetzeler at this time. Mr. Goetzeler can build on a solid foundation, and he has both the leadership qualities and experience to take Aixtron successfully onto the next level.“


Kim Schindelhauer, the chairman of the Supervisory Board of Aixtron SE, expressed his gratitude to Hyland for his contributions to the company and says, “Mr. Hyland has successfully managed the Company during his tenure through many ups and downs in the semiconductor industry. For


Sensor Electronic Technology, Inc. (SETi) launched a new line of UVTOP products in surface mount packages at the 2013 SPIE Photonics West show.


Initial devices added to this product line will operate with peak operating wavelengths at 275nm and 310nm respectively. Additional wavelength specifications will be added to the product line in the near future.


This SMD based line of UVTOP LEDs has been developed to address high volume markets that demand lower device and assembly costs.


The ceramic package dimensions are 3.5mm x 3.5mm and are available with UV stable encapsulation, a flat glass window, or a hemispherical glass window. Windowless devices are also available.


The entire range of UVTOP LEDs will remain available in TO packages for lower volume requirements, customised specifications and for customers who prefer a through-hole package.


In 2012, SETi opened its high volume manufacturing facility for UV LEDs, driving the cost of manufacturing down. Now, by employing new high volume packaging techniques and with the use of this cost effective ceramic package, SETi is bringing the UVTOP LEDs to new mass-volume markets where the TO package is not the most effective solution.


Laytec upgrades in-situ GaN


LED monitoring system The firm’s latest UV pyrometer incorporates real-time UV emissivity correction for enhanced accuracy of gallium nitride surface temperature during the growth of complex LED structures


In an ideal world, LED manufacturers would know the emission wavelength of the final device during MOCVD growth.


Today, according to the Solid State Lighting road map, the wavelength variation across a wafer should be less than 1 nm.


March 2013 ww.compoundsemiconductor.net 81


this, we would like to express our great appreciation. We are delighted to have found someone like Mr. Goetzeler, a versatile manager with extensive knowledge in the high-tech market and international experience. Mr. Hyland will actively support Mr. Goetzeler in taking up his office and ensure a smooth transition.”


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