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Sumitomo to use Soitec technology on GaN substrates
SOITEC and Sumitomo Electric Industries have signed a licensing and technology- transfer agreement. Sumitomo Electric will use Soitec’s proprietary Smart Cut technology to manufacture engineered GaN substrates.
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This announcement is a key step in the on going strategic alliance, launched in December 2010 to leverage Sumitomo Electric’s expertise in materials technology and Soitec’s unique Smart Cut layer-transfer technology to develop the global market for GaN substrates used in high-performance LED lighting applications.
The joint development program between Soitec and Sumitomo Electric has already successfully demonstrated the capability to produce four- and six-inch engineered GaN substrates in a pilot production environment. High-quality, ultra-thin layers of GaN have been repeatedly transferred from a single source wafer onto multiple substrates developed by Sumitomo Electric. The engineered wafers have exhibited high functionality at a low production cost.Having proven the effectiveness of the technology- transfer
Nichia powers Excelitas UV LED lighting modules
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EXCELITAS TECHNOLOGIES has launched CurX, the firm’s first UV LED solution for the printing and curing industry. CurX is suited for demanding applications such as digital ink printing, screen printing, flexo printing, offset printing, and the curing of coatings, adhesives, glues and varnishes. The CurX UV-LED module is a linear, scalable, high-end UV LED curing “flood” module available in 365 nm, 385 nm and 395 nm ranges of UV output. The device, which incorporates LED technology from Nichia, delivers up to 50 percent higher irradiance than other products on the
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www.compoundsemiconductor.net March 2013
process, Sumitomo Electric will now industrialise the product and invest in Smart Cut technology.
Soitec’s Smart Cut technology has been developed in collaboration with the CEA- Leti of France, one of the world’s premier microelectronics research laboratories.
It uses both implantation of light ions and wafer bonding to respectively define and transfer ultra-thin, single-crystal layers from one substrate to another. It works like an atomic scalpel, allowing active layers to be managed independently from the supporting mechanical substrate. The technology enables the development of new families of standard and custom engineered wafers. It was made viable for high-volume commercial production by Soitec, and is now protected by more than 3,000 Soitec-owned or controlled patents worldwide.
Soitec leverages the Smart Cut technology to manufacture engineered wafers for the world’s leading chipmakers, and holds exclusive rights to use and license this technology to third-party materials and process suppliers.
market, and features an ultra compact design for easy integration. It also features a sophisticated water cooling system that provides a consistent operating temperature for maximum performance. CurX is comprised of a ceramic substrate with multiple UV LED dies, a driver, and controller for fast switching and easy dimming.
The CurX UV-LED module is fully customisable to meet specific needs of customers and requires no mechanical switches.
“In keeping with our commitment to continuously innovate, I am delighted that the CurX UV-LED module now provides the printing and curing industry with a high-performance, energy-efficient, longer life solution,” says Joel Falcone, senior vice president and general manager, Excelitas Technologies.
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