September, 2020
www.us-
tech.com
Page 85 200,000 Interconnect Models Available from Samtec
NEW ALBANY, IN — Samtec now has over 200,000 symbols and foot- prints available for its interconnect products, which can be found at
www.samtec.com, as well as Snap - EDA and affiliated services. Engineers often spend days cre-
ating digital models for each compo- nent on their circuit boards, such as symbols and footprints. Samtec and SnapEDA have teamed up to make
Fujipoly Releases TIM Sample Kit
CARTERET, NJ — Fujipoly has introduced a comprehensive engi- neering kit that includes free sam- ples of 20 different Sarcon® thermal interface materials (TIMs). The sam- ple kit gives engineers the flexibility to test the performance properties of multiple Sarcon materials, in order to find the perfect option for their application. The wide selection of products
in the kit offer thermal conductivities that range from 0.9 to 13 W/m-K.
these models readily available to engineers. In the second quarter of 2020,
SnapEDA created over 120,000 new Samtec connector models, including high-speed and micro-pitch board-to- board, edge card, and rugged connec- tors. With these new connector mod- els, engineers can now easily discov- er, and design-in Samtec products. Connector models are highly
sought after by engineers because it is time-consuming to create models. This is due to their nonstandard bod- ies, custom solder stencils, fine pitch- es,
irregular pad shapes, and
cutouts. Connectors are the third most popular category of components on SnapEDA.
Samtec has greatly expanded its selection of connector models.
All models can be downloaded
from Samtec’s website. They are also available on SnapEDA, as well as from over a dozen of its collaborators including Digi-Key and Mouser.
Formats supported include Cadence OrCad, Allegro, Altium, Autodesk Eagle, Mentor PADS, KiCad, PCB123, and Proteus. These new, high-quality models
were created by SnapEDA’s compo- nent engineering team using propri- etary, patented technology. They include accurate assembly, silkscreen, and contoured courtyards, and follow Samtec’s recommended PCB layouts and stencil patterns. Through-hole pads follow IPC-2221 standards using
nominal drill hole sizes. Contact: Samtec USA, 520 Park
East Boulevard, P.O. Box 1147, New Albany, IN 47151 %812-944-6733 E-mail:
ashley.quinlan@samtec.com Web:
www.samtec.com
Thermal interface material sample kit.
Fujipoly America is a wholly owned subsidiary of Fuji Polymer Industries Co., Ltd. An ISO9001:2015-regis- tered company, Fujipoly specializes in the fabrication of silicone rubber technology. The company’s products include
elastomeric connectors, thermal inter- face materials, fusible tapes, and cus- tom silicone rubber extrusions. Fuji has twelve divisions worldwide, locat- ed in North America, Europe and Asia, and an international network of
distributors and representatives. Contact: Fujipoly America
Corp., 900 Milik Street, Carteret, NJ 07008 % 732-969-0100 E-mail:
fhobler@fujipoly.com Web:
www.fujipoly.com
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The 53rd International Symposium on Microelectronics, IMAPS 2020,
will be moving to a virtual environment from October 5-8.
The Symposium will no longer take place in San Diego, California.
Preparations are well under way to launch a Symposium experience that attendees, speakers, and exhibitors can safely enjoy from home. The theme Enabling a Connected World: Always On! is more relevant than ever as we debut this highly interactive online experience with truly global reach. Attendees can continue to expect the same valuable technical content as our in-person event, including:
• Live keynotes and panel sessions • Live professional development courses
• Five tracks and over 80 technical speakers and poster presentations Access more presentations with on-demand presentations!
• Networking and solutions in the virtual exhibit hall • Attendee to attendee networking opportunities • And more!
The full broadcast schedule, virtual tools, and registration details will be announced soon! Stay updated at
www.imaps2020.org.
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