September, 2020
www.us-
tech.com
Page 31 Rehm Offers Contact Soldering with Vacuum
ROSWELL, GA — Rehm has launched its Nexus soldering system, designed to guarantee the best results with a reflow soldering process using con- tact heat under vacuum. The system is aimed at applications in advanced packaging and power electronics. The contact soldering system under vacuum
is also well-suited for void-free soldering of various components, such as IGBTs, on DBC substrates. The substances are usually joined from different raw materials under vacuum at temperatures up to 842°F (450°C). One advantage of the next soldering system is
that the heating and cooling gradients can be de- fined based on predetermined parameters and pre- set as required. The temperature is then adjusted automatically based on these limits. The heating output of the Nexus has been de-
signed for a uniform heating process when fully loaded with high-mass as- semblies, making short cycle times pos- sible without issue. Sensors determine and verify the temperatures recorded on the product carrier supports.
Semiconductor and Advanced Packaging Inspection from TRI
SAN JOSE, CA — Test Research, Inc., (TRI) is now offering test and inspec- tion solutions for semiconductor and advanced packaging production lines. For this industry, the company is of- fering its TR7700QE-S 3D AOI, which is powered by metrology precision and flexible inspection algorithms. The
Vacuum soldering can boost productivity in
power electronics manufacturing. The vacuum en- sures an oxide-free process and significantly re- duces the voiding in soldered joints, allowing plas- ma cleaning and atmosphere exchange in ad- vanced packaging. The reduced pressure helps to minimize oxi-
dation on the components and on the solder joints themselves. The heat is transferred through both thermal conduction and by radiation. The system’s compact dimensions and ease of use make it par- ticularly suitable for low- to medium-volume pro-
duction, as well as in laboratories. Contact: Rehm Thermal Systems, LLC, 3080
Northfield Place, Suite 109, Roswell, GA 30076 % 770-442-8913 fax: 770-442-8914
Nexus contact soldering system.
E-mail:
c.kramer@
rehm-group.com Web:
www.rehm-group.com
Momentum II Printers NEW Momentum® II BTB TR7700QE-S inspection system.
system can detect defects in wire- bonds, die bonds, SMDs, bumps, wafer ICs and chips, underfill, and solder joints. For the PCB assembly industry, TRI offers
its award-winning
TR7007Q 3D SPI solution. The company has a robust port-
folio of automatic test and inspection solutions. From SPI, AOI and AXI systems to MDAs and ICT equip- ment, TRI provides cost-effective so- lutions to meet a comprehensive range of manufacturing test and in-
spection requirements. Contact: Test Research USA,
Inc., 832 Jury Court, Suite 4, San Jose, CA 95112 % 408-567- 9898 fax: 408-567-9288 E-mail:
triusa@tri.com.tw Web:
www.tri.com.tw
Learn more at
www.itweae.com See at SMTAI Virtual A division of Illinois Tools Works
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