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Page 82


www.us- tech.com


September, 2020 Microchip Launches SSD Controller


CHANDLER, AZ — Microchip has launched its newest member of the Flashtec® family, the Flashtec NVMe 3108 PCIe Gen 4 enterprise NVMe SSD controller. The eight-channel Flashtec NVMe 3108 complements the 16-channel Flashtec NVMe 3016 and provides a full suite of PCIe Gen 4 NVMe SSD solutions to support a comprehensive set of data center storage requirements. As data centers support more AI and machine


learning workloads, there is a need for cloud-scale infrastructure that provides more bandwidth to storage and more storage density per rack. The trend is to adopt PCIe® Gen 4-capable NVM Express™ (NVMe™) solid state drives (SSDs) in smaller form factors. These SSDs require controllers with opti- mized footprints and power, while driving the


NAND flash to its max and maintaining a rich fea- ture set and reliability. Microchip’s new SSD controller enables a


variety of compact SSD form factors with efficient power and compelling performance and reliability,


along with security. The Flashtec NVMe 3108 offers more than one million IOs per second (IOPS) for random workloads and greater than 6 Gb/s of sequential bandwidth. The solution is designed to provide end-to-end


enterprise data integrity with high reliability and critical security features, including secure boot with hardware root of trust. The eight programmable flash channel con-


trollers are coupled with strong error correction engines that provide future-proof support for next- generation high layer count triple level cell (TLC)


and quad level cell (QLC) NAND technologies. Contact: Microchip Technology, Inc., 2355


NVMe SSD controller.


West Chandler Boulevard, Chandler, AZ 85224 %480-792-4386 E-mail: cathy.gedvilas@microchip.com Web: www.microchip.com


An Affiliate of IPC


ETEL Intros Motion System for Heavy Payloads


2021 WHMA 28th ANNUAL WIRE HARNESS CONFERENCE


FEBRUARY 16–18 | The Westin La Paloma Resort & Spa | Tucson, AZ p


VULCANO2 motion system. With its gantry stacked-axes


architecture and ETEL’s renowned iron-core linear motors, coupled with HEIDENHAIN’s optical encoders, the compact VULCANO2 offers unmatched performance at nanome- ter-level positional stability. The VULCANO2 is a direct-


WHMA Annual Wire Harness Conference is your opportunity to grow, share, and discover new approaches to the wire harness industry.


Enjoy a number of timely presentations on topics important to wire harness manufacturers, OEMs and suppliers. Participate in networking events, best-practices roundtables and a tradeshow with industry leading suppliers. It’s a conference you do not want to miss!


drive system designed for both fron- tend and backend semiconductor applications with payloads up to 176 lb (80 kg). Key features include: ±250 nm of bidirectional repeatability at 82 ft/s2 (25 m/s2) acceleration, max speed of 3.9 ft/s2, and 3.2 in. (80 mm) move and settle to a ±100 nm window in a maximum of 170 ms. The bottom-axes gantry design of


the VULCANO2 is designed to guar- antee superior repeatability, while an iron-core motor solution delivers high dynamics. A granite base has been chosen to yield improved motion flat- ness at the tool point, while minimiz- ing accuracy losses when operating at high duty cycles. The solution also allows for


dynamic cable routing through the granite, resulting in a very compact solution that maximizes the ratio between dynamic performance and volume. The motion stage is shaped with x/y and x/y/t configurations, allowing it to be used as an easy drop- in solution into equipment that previ-


FOR MORE INFORMATION OR TO REGISTER FOR THE CONFERENCE, visit www.annualconference.whma.org.


See at SMTAI Virtual


ously used lower dynamic stages. Contact: HEIDENHAIN Corp.,


333 E. State Parkway, Schaumburg, IL 60173 % 847-519-4702 E-mail: bzlotorzycki@heidenhain.com Web: www.heidenhain.us


SCHAUMBURG, IL —ETEL, a part of the HEIDENHAIN Group, has intro- duced its latest motion system, the VULCANO2, which is designed to pro- vide high throughput for heavy pay- loads in semiconductor manufacturing.


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