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www.us-tech.com
September, 2020 ElEctronic Mfg SErvicES
ASM and RIT’s Expanded Partnership Produces Tomorrow’s Industry Leaders
By Michael Skinner, Editor
CEMA) expanded their strategic partnership. The agreement committed additional resources to fos- ter technology research, workforce development programs and industry training initiatives. More than conceptual commitments, both ASM and RIT have undertaken specific actions that continue to produce tangible results.
I
Expanded Investment The two organizations have a long history of
cooperation. ASM placement equipment was first installed at RIT in 2003, giving students access to some of the industry’s most advanced platforms. Recently, however, the dedication to this
promise of technology availability has been ex- panded significantly by both parties, in recognition of the importance of a well-equipped assembly line and analysis tools to support modern-day electron- ic complexities. The 2017 delivery of ASM’s DEK Horizon 01iX
stencil printer and SIPLACE SX2 placement system supported several student-led research initiatives and important thesis work. Recently, the newest
n 2017, ASM Assembly Systems and the Rochester Institute of Technology Center for Electronics Manufacturing and Assembly (RIT
ASM DEK NeoHorizon 01iX was installed at CEMA. Other suppliers have made capital invest-
ments to complete the assembly. The lab’s equip- ment includes high-power microscopes and AOI systems, not only to build assemblies, but to con- duct in-depth root cause analysis evaluation that informs process and product development. “The new DEK printer will be integral to sev-
From left: Dr. Martin K. Anselm, director of RIT’s CEMA lab, Dr. S. Manian Ramkumar, dean of RIT’s college of engineering technology, and Jeff Timms, managing director, ASM Americas.
eral successful projects at CEMA,” says Jeff Schake, ASM senior engineer. Schake works out of the RIT CEMA facility and has mentored several students. “With this system, we can process small- er, thinner boards, simplify tooling setups and seamlessly build double-sided assemblies through the use of Grid-Lok. We can simulate industry printing tempos, due to enhanced understencil cleaning efficiency and automatic solder paste management.” According to Schake, these capabil- ities, along with the available analytical tools, have made certain projects possible and have vast- ly improved the quality of the lab’s work. While equipment investment is vital to the
technology initiatives at CEMA, the commitment of staff and supplier partners with technical ex- pertise and broad industry perspective provides
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