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Greenwood, SC — Targano has intro- duced its latest lineup of digital microscopes, which spans both top-
www.us-tech.com
of-the-line and simple, cost-efficient solutions. All the microscopes are characterized by user-friendliness
THE NEW
BENCHMARK IN WIRE STRIPPING
and versatility. The company’s most popular
microscope, Tagarno FHD Trend, is based on a smart, digital, visual inspection platform that can be altered and customized to fit specific needs over time. With this type of microscope, the customer invests in a machine that can be continuously upgraded as needs change. The FHD Trend allows the quick
development of new and innovative applications based on market de - mands. The platform supports ongoing quarterly-released firmware updates, giving users access to new applications and im proved user interfaces as they are launched. All that is needed is to download the latest firmware file to a USB stick, plug it into the microscope and perform a quick system update. Previously-released features include focus stacking, a measurement appli- cation that enables the user to perform accurate measurements on an object and an onscreen ruler. The company also offers simpler,
The
Mira 230 has a new robust and
sturdy design that supports an extraor- dinary processing range from AWG 32 to AWG 8. It sets a new benchmark by its unique sequencing capabilities that can be stored in a library for quick reproduction. The Mira 230 can strip and cut inner conductors with a variety of parameters without a program change. It comes equipped with a simple graphical user interface that ensures a quick learning process.
komaxwire.com
September, 2017 Tagarno Intros Customizable Digital Microscopes
yet flexible, systems. The FHD ZIP and FHD ZAP microscopes are useful in combination and share some of the same functions. While FHD ZIP is suitable for workbench processes, such as hand soldering or solder joint inspection, FHD ZAP is mounted on a
Tagarno FHD Trend digital microscope.
flex arm for in-line inspection. Contact: Tagarno USA, LLC,
111 Runnymeade Street,
Greenwood, SC 29649 % 864-229-9769 E-mail:
mail@tagarno.com Web:
www.tagarno.com
See at SMTAI, Booth 1024
KwikTic Offers Scalable MES Solutions
Wigan, UK — KwikTik is now offer- ing scalable and affordable MES soft- ware solutions to small and medium- sized manufacturers. These compa- nies can now benefit from software that was previously only available to larger-sized companies. Features of the MES solutions
include digital work instructions, enforced routing, traceability, report- ing, and inspection. The software is built to simplify current manufactur- ing processes. Whether the customer is assembling, testing or repairing products, there are likely to be signif- icant benefits to using KwikTic. The
system allows customers to more eas- ily meet the compliance require- ments for aerospace, military and other high-reliability markets. KwikTic is simple, powerful,
quick to set up, and provides low-cost scalability and flexibility. It is also compatible with MRP and IT sys- tems, manufacturing equipment,
AOI systems, and test equipment. Contact: KwikTic, Ltd., 10-12 Upper Dicconson Street, Wigan,
Lancashire, WN1 2AD, UK % +44-0-1942-366216 Web:
www.kwiktic.com
See at SMTAI, Booth 1001
Albany, NY — Dr. Wusheng Yin, president of YINCAE Advanced
YINCAE President Presents at SMTAI
Materials, is presenting his white paper “High-Reliability and High- Temperature Application Solution — Solder Joint Encapsulant Paste” at SMTA International. The presentation will be held on
Wednesday, September 20 at 9:00 a.m. in room FSA3. Founded in 2005, with head-
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quarters in Albany, New York, YIN- CAE develops solder joint encapsu- lants, underfill materials, die attach adhesives, wafer-level materials, optoelectronic materials, and confor- mal coatings. YINCAE products provide new
technologies to support manufactur- ing processes from wafer- and pack- age-level to board-level and finished devices, while facilitating smarter and faster production. Some of the company’s latest
products include: BP 256 ball-bump- ing adhesive, DA 90 low-temperature die attach adhesive, SMT 158D ther- mally-conductive underfill, TGP 110 thermal grease, and SMT 256EP sol-
der joint encapsulant adhesive paste. Contact: YINCAE Advanced
Materials, LLC, 19 Walker Way, Albany, NY 12205 % 518-452-2880 E-mail:
info@yincae.com Web:
www.yincae.com
See at SMTAI, Booth 329
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