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Page 120


hi-TeCh evenTS www.us-tech.com iNEMI’s Bill Bader Gives Keynote at SMTAI


Minneapolis, MN —Bill Bader, CEO of iNEMI, will keynote the 2017 Technical Innovations Symposium on Monday, September 18, 2017, at SMTA International. SMTA Inter - national will be held from September 17-21, 2017 in Rosemont, Illinois. Bader’s presentation is titled “2017 iNEMI Roadmap Highlights Impact - ing Board Assembly Over the Next 5- 10 Years.” The iNEMI roadmap has become


recognized as an important tool for defining what is “state-of-the-art” in the electronics industry, as well as identifying emerging and disruptive technologies. The keynote presenta- tion will discuss the major trends that will impact board and component assembly in the near future, with insights to identify potentially disrup- tive innovations that could be the basis for radical changes to current programs and equipment.


SMTA and SMART Host Harsh Environments Conference


Amsterdam, The Netherlands — SMTA and SMART Group are co- organizing the Electronics in Harsh Environ ments Conference, which will be held April 24-26 in Amsterdam. The conference will focus on building reliable electronics used in power elec- tronics and harsh environments. Thermal, power and signal


integrity requirements can present challenges in harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over-powering or overheating


of a device can have serious conse- quences, including internal package failure, downstream device errors and second-level interconnect solder joint failures. Soldering residues are more


problematic, and if not understood, can result in both intermittent and complete device failure.


This conference will focus on


the challenges and best practices for building reliable electronic devices that will perform to design stan- dards when used in harsh environ- ments. The content will be focused on building reliable, high-density assemblies, power electronics, elec- tric hybrids, product assembly chal- lenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas, such as


high-temperature soldering, solder material advances, and new stan-


dards will be presented. Contact: SMTA, 6600 City West


Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web: www.smta.org and SMART Group, c/o 77 Mill Road, Husborne Crawley, Bedford, MK43 0XF, UK % +44-0-208-4322741 E-mail: info@smartgroup.org Web: www.smartgroup.org r


2018 EDITORIAL AND ISSUE Jan/Feb March EDITORIAL


Test & Measurement Electronics West/MDM PP


Assembly & Production APEX PP


April/May SMT & Assembly Nepcon China PP


Wire Processing Tech PP EDS PP


June July August


Test & Automation SMT/Hybrid/PKG PP ATX East /MDM PP


Production & Packaging Semicon West/Intersolar PP


PCB & Assembly Nepcon South China PP


September Test & Automation SMTAI PP


October Nov/Dec


Components & Distribution electronica PP


PP= Product Preview


Test & Measurement E


TRADESHOW CALENDAR SHOW


DATE DesignCon ATX/ Electronics West/MDM


APEX APEC


Advanced Design & Mfg Expo


BIOMEDevice Boston/ESC Nepcon China


Wire Processing Tech EDS


SMT/Hybrid/PKG ATX East /MDM


SEMICON West/Intersolar


Nepcon South China PCB West Autotestcon


IMAPS SMTAI


The Assembly Show MDM Minneapolis


FABTECH electronica ATX Montreal


BIOMEDevice, ESC


Jan. 30-Feb. 1 Feb. 6-8


Feb. 27-March 1 March 6-8 March 7-8


April 18-19 April 24-26 May 9-10 May 15-18


June 5-7 June 12-14


July 10-12


Aug. 28-30 Sept. 11-13 Sept. 18-20


Oct. 9-11 Oct. 17-18 Oct. 23-25 Oct. 31-Nov. 1


Nov. 6-8 Nov. 13-16 Nov. 14-15


Dec. 5-6 F


LOCATION


Santa Clara, CA Anaheim, CA


San Diego, CA San Antonio, TX Cleveland, OH Boston, MA


Shanghai, China Milwaukee, WI Las Vegas, NV


Nuremberg, Germany New York, NY


San Francisco, CA


Shenzhen, China Santa Clara, CA National Harbor, MD


Pasadena, CA Rosemont, IL Rosemont, IL Minneapolis, MN


Atlanta, GA


Munich, Germany Montreal, Quebec


San Jose, CA A


Bill Bader joined iNEMI in


August 2009 as CEO. He is a 26-year veteran of Intel, and he brings to iNEMI a wide range of experience, including factory management for high-volume production, new product development, hardware and software design and test, and assembly and test technology development. He also served as Intel’s representative on the iNEMI Technical Committee from 1998 to 2005. The Technical Innovations


Symposium at SMTA International will exhibit new research from compa- nies and institutions, such as Celestica’s Center for Mechatronics and Automation, Fraunhofer


Institute, Harris Corporation, i3 Electronics, National Physical Laboratory, and Plexus, among oth- ers. Session topics include micro-dis- pensing and additive manufacturing developments, adhesive and coating development and characterization, adhesive development and characteri- zation, and panel processing technolo- gies for packaging. A panel of industry experts will give short presentations and discuss trends in lead-free and other advanced packaging technolo-


gies to wrap up the symposium. Contact: SMTA, 6600 City West


Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952- 926-1819 Web: www.smta.org r


Trade Show Calendar MORE SHOWS: www.topline.tv/tradeshows.cfm


September 19-20, 2017, SMTA International.*Donald E. Stephens Convention Center, Rosemont, IL. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web: www.smta.org


October 3-4, 2017, Sensors Midwest. * Donald E. Stephens Convention Center, Rosemont, IL. Contact: Questex, LLC, 275 Grove Street, Suite 2-130, Newton, MA 02466 % 617-219-8300 Web: www.sensorsmidwest.com


October 10-12, 2017, IMAPS.*Raleigh Convention Center, Raleigh, NC. Contact: IMAPS, P.O. Box 110127, Research Triangle Park, NC 27709 % 919-293-5000 fax: 919-287-2339 E-mail: modonoghue@imaps.org Web: www.imaps.org


October 24-26, 2017, IWLPC. * DoubleTree by Hilton San Jose, San Jose, CA. Contact: SMTA, 6600 City West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web: www.smta.org


October 24-26, 2017, The Assembly Show. * Donald E. Stephens Convention Center, Rosemont, IL. Contact: BNP Media, 2401 W Big Beaver Road, Suite 700, Troy, MI 48084 % 248-362-3700 E-mail: amy@theassemblyshow.com Web: www.theassemblyshow.com


October 24-26, 2017, SOUTH-TEC. * TD Convention Center, Greenville, SC. Contact: SME, One SME Drive, Dearborn, MI 48128 % 313-425-3000 E-mail: service@sme.org Web: www.sme.org


October 31-November 2, 2017, International Test Conference. *Fort Worth Convention Center, Fort Worth, TX. Contact: Courtesy Associates, 2025 M Street NW, Suite 800, Washington, D.C. 20036% 202-973-8665 fax: 202-331-0111 E-mail: itc@courtesyassoc.com Web: www.itctestweek.org


November 6-9, 2017, FABTECH. * McCormick Place, Chicago, IL. Contact: SME, One SME Drive, Dearborn, MI 48128 % 313-425-3000 E-mail: service@sme.org Web: www.sme.org


November 8-9, 2017, MD&M Minneapolis. * Minneapolis Convention Center, Minneapolis, MN. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web: www.ubmcanon.com


November 14-17, 2017, productronica. * Munich Expo Fairgrounds, Munich, Germany. Contact: Messe München GmbH, Messegelande, 81823 Munich, Germany


% +49-89-949-20720 fax: +49-89-949-20729 E-mail: info@messe-muenchen.de Web: www.messe-muenchen.de


November 15-16, 2017, Printed Electronics USA. * Santa Clara Convention Center, Santa Clara, CA. Contact: IDTechEx, One Boston Place, Suite 2600, Boston, MA 02108 % 617-577-7890 fax: 617-577-7810 E-mail: info@idtechex.com Web: www.idtechex.com


December 5-7, 2017, 3D ASIP. * Marriott San Francisco Airport, San Francisco, CA. Contact: IMAPS, P.O. Box 110127, Research Triangle Park, NC 27709 % 919-293-5000 fax: 919-287-2339 E-mail: modonoghue@imaps.org Web: www.imaps.org


December 6-8, 2017, IPC APEX South China. * Shenzhen Convention & Exhibition Center, Shenzhen, China. Contact: Hong Kong Printed Circuit Association, Unit B, 22/F, Legend Tower, 7 Shing Yip Street, Kwun Tong, Kowloon, Hong Kong % 852-2155-5099 fax: 852-2155-9099 E-mail: secretary@hkpca.org Web: www.hkpca-ipc-show.org


January 9-12, 2018, CES. * Las Vegas Convention Center, Las Vegas, NV. Contact: Consumer Technology Association, 1919 Eads Street, Arlington, VA 22202 % 866-233-7968 E-mail: cesreg@cta.tech Web: www.ces.tech


January 31-February 1, 2018, Design Con. * Santa Clara Convention Center, Santa Clara, CA. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 415-947-6105 E-mail: ian.doyle@ubm.com Web: www.designcon.com


February 6-8, 2018, MD&M West. * Anaheim Convention Center, Anaheim, CA. Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web: www.mdmwest.mddionline.com


September, 2017


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