September, 2017 Continued from page 64


The finished components are moved on to sol- dering in a highly-flexible SelectLine system. The system is equipped with two electromagnetic sol- der units with different soldering nozzle sizes to accommodate a wide variety of different soldering geometries without retooling.


PCBs that are soldered exclusively on SelectLine systems are passed through a separating station and are automatically returned to the assem- bly workstations. The other PCBs are automatically passed to a PowerSelective system for further pro- cessing. PowerSelective systems are also equipped with a mini-wave soldering unit, as well as a conven- tional soldering wave as a special feature. “This enables us to cover a highly-varied prod- uct range with one soldering system. The flexible, programmable gripper system can be freely rotated and tilted and gives us an excellent solder outline and high-quality soldering results,” says Kühn. “Any production system is only as good as the components that have been installed in it,” he adds. This is clearly shown, as the type of industrial PC that is produced using this manufacturing cell is the one that ensures process reliability for the PowerSelective system.


SEHO’s soldering systems are designed to provide 100 percent auto- mated process control. “Process safety is obviously our top priority,” says Kühn. “The SIMATIC industrial PCs are designed to provide maximum per- formance and durability. This would hardly be possible without a repeat- able manufacturing process.”


Strength through Partnership


In selective soldering processes where the smallest structures must be processed with high accuracy, residues in the solder nozzle can have a major impact on reproducibility and the quality of the results. “Depending on the type of solder alloy and the number of soldering cycles, the solder nozzle may show signs of flux deposits and oxide residue which would negatively affect the sol- dering result,” explains Alexander Blum, SEHO Systems’ product manag- er. A quality process depends on a robust solder wave height and wetting surface. An evenly-wetted and oxide- free soldering nozzle is very important. Soldering nozzles have to be cleaned and rewetted regularly. This is a process that typically requires the use of aggressive chemicals, as well as sys- tem downtime.


The industrial PC manufactur- ing cell at Karlsruhe is in constant operation; production stoppage to allow the nozzles to be cleaned man- ually is not an option. Instead, the SelectLine has been fitted with SEHO’s patented ultrasonic cleaning technology. In freely-programmable cleaning cycles, the liquid solder is oscillated, which gently cleans the nozzle surfaces and re-wets them, excluding atmospheric oxygen. “Our experience has shown that cyclical ultrasonic cleaning significant- ly improves the service life. With SelectLine nozzles, we have an aver- age service life of approximately two months. Typically we would only get a few days with other comparable sys- tems,” says Kühn. “The extended serv- ice life has a positive impact on process reliability, and the automation of the ultrasonic cleaning process reduces the system operator’s workload.” In addition to higher availabili- ty and lower material wear, the sys- tems have low environmental impact as no chemicals are used during the cleaning process. “This, in combina- tion with other automated control


The Karlsruhe site has many specific workstations and systems for component handling and material management that match customers’ production needs.


mechanisms that are integrated in the system, ensures a fully-monitored process,” says Blum. “The same stringent requirements that our industrial PCs satisfy, we also place on our produc- tion processes,” says Kühn. “In SEHO we have a partner on our side who takes the same approach.” The electronics industry is one of the most dynam- ic sectors worldwide and constantly presents new challenges to manufacturers. This is especially true for leading-edge, innovative companies. “At times, our attempts to optimize production processes seem unorthodox,” Kühn concludes. “But with SEHO as our supplier, we always have a com- petent partner with whom we can discuss new applications.” Contact: SEHO North America, Inc., 1420 Jamike Drive, Suite 300, Erlanger, Kentucky 41018  859-371-7346


E-mail: sehona@sehona.com Web: www.sehona.com 


Even more perfect. NEW


Ultra-high resolution takes 3D AOI to a whole new level.


Ultra-High Res MRS Sensor


Powered b eredby MRS Technology S Technology


www.us-tech.com SEHO Selective Soldering and Flexible PC Production


Page 67


You won’t believe your eyes. Luckily, you won’t need to. When an even higher degree of accuracy and reliability are critical, our new Ultra-High Resolution MRS sensor adds unprecedented performance to CyberOptics’ award-winning SQ3000™ 3D Automated Optical Inspection system. With a 7μm resolution, this sensor option is perfect for 0201 metric and micro-electronic applications. The Multi-Reflection Suppression (MRS) technology inhibits reflections, and combines with sophisticated 3D image fusing algorithms to deliver microscopic image quality at production speed. See like never before.


Watch the SQ3000 video at http://bit.ly/2oR4fPg


www.cyberoptics.com Copyright © 2017. CyberOptics Corporation, Inc. All rights reserved. See at SMTAI, Booth 1416


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124