September, 2017
www.us-tech.com
Page 79 MIRTEC Exhibits 3D AOI and SPI Lineup
Oxford, CT — MIRTEC is offering a complete lineup of 3D AOI and 3D SPI systems, including the MV-6 OMNI 3D AOI, MS-11e 3D SPI, and the all-new MV-3 OMNI desktop 3D AOI system. The MV-6 OMNI 3D AOI system
is configured with MIRTEC’s exclu- sive OMNI-VISION® 3D inspection technology. The system combines 15 MP CoaXPress camera technology with the company’s eight-projection digital multi-frequency 3D moiré sys- tem in a newly-designed, cost-effec- tive platform. The vision system is a proprietary camera system designed and manufactured by MIRTEC for use with its complete product range of 3D inspection systems. The eight-pro- jection digital multi-frequency 3D moiré technology provides 3D inspec- tion, yielding precise height measure- ment data. Fully-configured, the MV- 6 OMNI contains four 10 MP side- view cameras in addition to a 15 MP top-down camera. The MS-11e 3D SPI Machine is
also configured with a 15 MP CoaXPress vision system, providing
KIC Displays Smart Oven Profilers
San Diego, CA — KIC is now offering a line of smart oven profiling technol- ogy, including its latest device, the SPS smart profiler. Other products include the RPI automatic profiling system and the company’s new
SPS smart oven profiler.
Vantage ecosystem with networked, real-time dashboard. Vantage automatically acquires
and delivers insightful information from all the ovens in a factory in real- time, allowing engineers to produce consistent quality at lower costs. The software is retrofittable and can con- nect to the factory MES system. The core function of a reflow
oven is to produce an acceptable pro- file for each PCB. The new KIC SPS smart profiler collects profile data and compares it to the process speci- fications. Within seconds, the new smart profiler also suggests an improved reflow oven setup. The new thermal profiler has a
compact design made with a liquid crystal polymer enclosure for better heat protection and faster cool-down between profiles. It contains a rechargeable battery, profile stack- ing and private Wi-Fi for wireless data communication. This smart thermal profiler has been optimized for maximum thermal protection and
long-term operation. Contact: KIC, 16120 W
Bernardo Drive, San Diego, CA 92127 % 858-673-6050 fax: 858-673- 0085 E-mail:
abailey@kicmail.com Web:
www.kicthermal.com
See at SMTAI, Booth 123
excellent image quality, accuracy and fast inspection rates. The machine uses dual-projection, “shad- ow-free” 3D moiré technology, com- bined with a precision telecentric compound lens and precision laser PCB warpage compensation, to char- acterize each solder deposition after screen print. The MS-11e is designed to
measure solder volume, area, shape deformity, and x/y position, as well as inspect for bridging between adja- cent solder depositions. The MS-11e provides real-time, closed-loop feed- back to the screen printing system to effectively eliminate defects before they occur.
The new MV-3 OMNI desktop
3D AOI machine is also configured with the company’s OMNI-VISION
3D inspection technology. Fully-con- figured, the MV-3 OMNI contains four 10 MP side-view cameras in addi- tion to a 15 MP top-down camera. MIRTEC also offers its total
quality management system soft- ware, INTELLISYS®, which pro- motes continuous process improve- ment by allowing manufacturers to track and eliminate defects on
inspected assemblies. Contact: MIRTEC Corp., 3
Morse Road, Oxford, CT 06478 % 203-881-5559 fax: 203-881-3322
E-mail:
bdamico@mindspring.com Web:
www.mirtec.com
MV-6 OMNI 3D AOI system. See at SMTAI, Booth 616
See us at IWLPC in San Jose, Oct 24-26, 2017!
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