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Rent Test Equipment
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September, 2017
ACL Develops Silicone Conformal Coating
Chicago, IL — ACL has introduced a new silicone conformal coating, adding to its existing selection of rework and repair aerosols. The new transparent coating, #8695, is designed to provide insulation and protection for both flex- ible and rigid PCBs. The coating protects against sol-
dering heat, corrosive vapors, mois- ture, and fungus. The silicone-based resin helps to protect against corrosion on electronic components and PCBs in high-humidity environments and when saltwater is present. The conformal coating will not
stress delicate circuit components in high-heat applications. The coating does not fade, crack, yellow, or discol- or over time, under the conditions of normal use. It also contains a UV indicator
Call or visit us!
www.atecorp.com 800-404-ATEC (2832)
m 32)
Advanced Test Equipment Rentals
ntals
for quality control inspections. The material has no CFCs or HCFCs and is RoHS-compliant, as well as SVHC- free. The coating meets MIL-I- 46058C, Type SR and is manufac- tured in the U.S.
#8695 silicone
conformal coating aerosol. Contact: ACL Staticide, 840 W
49th Place, Chicago, IL 60609 % 847-981-9212
E-mail:
info@aclstaticide.com Web:
www.aclstaticide.com
See at SMTAI, Booth 1005
SHENMAO Introduces Lead-Free Solder Paste
San Jose, CA — SHENMAO has introduced a new lead-free solder paste, PF606-P140. The paste is designed for superior, continuous, high-speed printability with a wide reflow process window. It reduces head-in-pillow defects and can fit easily into complicated PCB designs. PF606-P140 helps to improve
in-circuit testability, by eliminating flux on top of the solder, preventing contamination of test pins. Minimal flux residue gathers near the outside of the solder joint on the PCB sub- strate, a substantial improvement over legacy solder paste. SHENMAO manufactures a
wide variety of solder products, including: water-soluble and no-clean solder paste, laser solder paste, cored solder wire, wave solder bar alloys, wave soldering fluxes, ex tremely pure solder powder up to Type 8, BGA and micro-BGA solder sphere, wafer-level packaging solder paste and fluxes,
LED die attach paste, high-perform- ance liquid fluxes, solder preforms, solar ribbon, and plating anode for PCB fabrication and semiconductor packaging processes.
PF606-P140 lead-free solder paste. Contact: SHENMAO America,
Inc., 2156 Ringwood Avenue, San Jose, CA 95131 % 408-943-1755 fax: 408-684-5477 E-mail:
usa@shenmao.com Web:
www.shenmao.com
See at SMTAI, Booth 534
Cogiscan Highlights Track, Trace and Control Solution
Bromont, Quebec, Canada — Cogiscan is showcasing its Co-NECT connectivi- ty software. The software supports all existing standards, such as SECS/ GEM, CAMX, ZVEI, and JSON, as well as proprietary interfaces from leading software and machine vendors. Co-NECT is a standalone, neu-
tral connectivity solution that addresses the greatest challenge in the industry today: connectivity between different machines, soft- ware and enterprise systems. This technology is designed to enable Industry 4.0 for electronics assembly. The Co-NECT connectivity
layer enables data exchange in real time in large manufacturing sites that may contain hundreds of machines. The architecture and sup- porting infrastructure is optimized to ensure that there is no delay or any
lag in response time, regardless of how many lines, machines and work- stations are connected. Co-NECT is built upon
Cogiscan’s standard TTC platform, which has been around for more than 15 years. It adapts to each individual customer’s environment, regardless of the mix of machines and software solutions already in place. The use of third-party connectivity middleware means that customers can keep their options open for the future, rather than limiting themselves to a single
vendor solution. Contact: Cogiscan, 28-B boule- vard de l’Aeroport, Bromont,
Quebec, Canada J2L 2N8 % 450-534-2644 E-mail:
info@cogiscan.com Web:
www.cogiscan.com
See at SMTAI, Booth 1031
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