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September, 2022


www.us - tech.com


TAMPA, FL — Leader Tech is now offering its latest engineer- ing tool, an SMS part sizing chart. The chart is designed specifically to help engineers find the best SMS part for their application at a glance.


On-Wafer Device and RF Testing from R&S


COLUMBIA, MD — Rohde & Schwarz now offers a test solu- tion for full RF performance characterization of the DUT on- wafer which combines the pow- erful R&S ZNA vector network analyzer from Rohde & Schwarz with industry-leading engineer- ing probe


systems from


FormFactor. As a result, semi- conductor manufacturers can perform reliable and repeatable on-wafer device characterization in the development phase, dur- ing product qualification and in production. To perform these essential


measurements, Rohde & Schwarz is supplying the high-end R&S ZNA vector network analyzer, which characterizes all RF quali- fication parameters at coaxial and waveguide levels, as well as fre- quency extenders for application ranges above 67 GHz. FormFactor addresses the


wafer contact with manual, semi-automated and fully auto- mated probe systems including thermal control, high-frequency probes, probe positioners, and calibration tools. The calibration of the com-


plete test system, including the R&S ZNA, is fully supported in the FormFactor WinCal XE cali- bration software. In the test setup, the user


has access to all test capabilities of the R&S ZNA thanks to the fully calibrated setup. Generic S-parameter tests allow charac- terization for filters and active devices, but distortion, gain and intermodulation tests can also be performed to qualify power amplifiers. Frequency translating meas -


urements for mixers with phase characterization across the band- width of the device are another example of the supported meas- urement applications of the joint solution.


Contact: Rohde & Schwarz


USA, Inc., 6821 Benjamin Franklin Drive, Columbia, MD 21046 % 888-837-8772 E-mail: dominique.loberg@rsa.rohde- schwarz.com Web: www.rohde-schwarz.com


For sponsorship information, contact


Brian Schieman, Executive Director bschieman@imaps.org


Leader Tech’s SMS shields


are supplied in tape and reel packaging and are suitable for any volume application, including automated pick- and-place assembly sys- tems.


Leader Tech has more


sizes and heights of stan- dard off-the-shelf shields than any other supplier. Both one and two piece shields are available in stock and ready to ship for customer parts. If a part is not in stock, the company can offer short lead times.


Leader Tech is a world lead-


ing innovator and manufacturer of EMI shielding products for cir-


Page 85 Engineering SMS Sizing Chart from Leader Tech


cuit boards, electronic enclosures, interconnect cables and thermal solutions. The Company serves a diverse commercial and mili- tary customer base. Leader Tech is a wholly owned sub- sidiary of HEICO Corpora - tion, a successful and growing technology-driven aerospace, industrial, defense and elec-


tronics company. Contact: Leader Tech,


Inc., 12420 Race Track Road, Email:


Tampa, FL 33626 % 866-855-6921


SMS part sizing chart.


sales@leadertechinc.com Web: www.leadertechinc.com


Conference: October 4-6, 2022 Exhibition: October 4-5, 2022


Professional Development Courses: October 3, 2022


SPONSOR & EXHIBIT SALES UNDERWAY!


The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. This year’s Symposium will focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL, and will feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!


• TRACK 1: SiP/Design/Manufacturing Optimization


• TRACK 2: Wafer Level/Panel Level (Advanced RDL)


• TRACK 3: High Performance / High Reliability


• TRACK 4: Advanced Package (Flip Chip, 2.5D, 3D, Optical)


• TRACK 5: Advanced Process & Materials (Enabling Tech.)


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