September, 2022


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InnovationLab Develops Reflowable Flex Circuit Printing


HEIDELBERG, GERMANY — InnovationLab, an expert in printed electronics, has an- nounced a breakthrough in addi- tive manufacturing of printed circuit boards (PCBs), helping meet higher environmental stan- dards for electronics production while also reducing costs. Within the research project


SmartEEs2, funded by Horizon 2020, InnovationLab and its partner ISRA have developed a novel manufacturing process for copper-based solderable circuits. The circuits are screen printed and are compatible with conven- tional reflow processes. Producing printed electronics


is an additive process that does not use toxic etchants, and runs at comparatively low temperatures, thus reducing energy consump- tion. Moreover, the substrates used in additive PCB manufactur- ing are up to 15 times thinner, compared to conventional tech- niques, which reduces material consumption and means the pro-


STI Offers Prototype


Development MADISON, AL — STI Electronics is a complete partner from sche - matic forward design through first article validation. A key step in this cycle is the prototype de- velopment process. Prototypes often consume more funding and time than budgeted. STI’s unique prototype development approach mitigates these expenses and re- duces the overall time to market for customers’ new products. The typical approach to proto-


type development is to design, check, build and evaluate. Upon completion of the evaluation, boards are “re-spun” to implement changes desired, thus adding time and money to the development cycle. STI’s approach is different with the company’s objective fo- cused on the implementation of corrective actions via rework and repair per IPC 7711/21 (STI is an approved development center for IPC 7711/21) to get the first proto- type to the customer’s desired “production” performance level. The product can be released for beta build and test once this mile- stone is achieved. The prototype development


process is complemented by the capabilities in the company’s an- alytical lab including but not limited to thermal shock, vibra-


tion, humidity, etc. Contact: STI Electronics,


Inc., 261 Palmer Road, Madison, AL 35758 % 256-461-9191 Web: www.stiusa.com


duction process has less waste. InnovationLab has so far


produced a physical prototype, which includes all the important blocks of a smart label. It uses a copper ink to ensure high con- ductivity. Component mounting can be done in a conventional re- flow soldering process, which en- ables manufacturers to switch to the new technology without in- vestment in new equipment. Multilayer layer printing, metal and dielectric, was used to


produce the target functionality: a low power temperature sensor and logger, an NFC communica- tion interface via a printed an-


tenna, and a compact battery that is charged from a printed solar cell, making the device completely self-sufficient. The new process can produce both standard and flexible PCBs with up to four layers and can be used in product and process develop-


ment for hybrid electronics. Contact: InnovationLab


GmbH, Speyerer Strasse 4, Printed, solderable flex PCB.


69115 Heidelberg, Germany % +49-6221-5419100 Web: www.innovationlab.de


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