September, 2022 Mission-Critical FPGAs:
U.S. National Defense “Painted into a Corner” Continued from page 53
box systems are more reliable than ball grid array (BGA) pack- ages. FPGA devices are construct- ed in some cases with thousands of solder columns, a critical sub- component smaller than a grain of rice, to electrically connect the FPGA to the printed circuit board assembly. These columns are specially
made pins and must be attached to the body of the FPGA. Although there are around 10 companies manufacturing radia- tion hardened FPGAs in the United States, only one small subcontractor is qualified to attach these pins to the FPGA component body. Is such a monopoly danger-
ous? What if a catastrophe such as a fire or other unforeseen dis- aster should disrupt production at the subcontractor? Without solder columns, FPGA cannot be effectively used. No FPGA, no warfighter in the air. It’s really that simple.
Sole Source vs. Single Source A sole source risk exists
when only one supplier can pro- vide a required capability. A sin- gle source exists when only one supplier is qualified to provide a required capability. EO 13806 draws a key distinction between sole source and single source. Multiple suppliers may exist, but only a single source for copper wrapped solder columns is cur- rently qualified, according to the Qualified Manufacturing List (QML-38535) published by the Defense Logistics Agency (DLA). Today, Original Device
Makers (ODM) of FPGA devices rely on just one single source subcontractor to attach copper wrapped solder columns for the entire aerospace and defense industry. As of the date of this publication, major ODM device makers, who control over 90% of all FPGA for aerospace and defense, have not taken steps to qualify a second source as a con- tingency backup. The principal reason cited for such inaction is the lack of a budget to qualify alternative subcontractors. Manufacturers of defense
grade FPGA are well-established companies. Likewise, makers of application specific integrated circuits (ASICs), are also major companies. In fact, approximate- ly 10 domestic companies make defense and space grade FPGA and ASIC devices with solder columns. Monopoly suppliers, though rare in the semiconductor industry, can drive up costs if left unchecked. Today, 90% of semiconduc-
tor companies that make defense grade FPGA are at the mercy of just a tiny, monopoly subcontrac-
See at SMTA Guadalajara, Booth 402
Column grid array FPGAs are used in mission-critical applications.
tor located in Silicon Valley, California. Its owners may be nearing the age when most business owners are contemplating selling the business or retiring. Also, the DLA cur- tailed on-site field audit visits due to COVID-19 as the primary reason for delays in the certification of FPGA column attach subcontractors. The DLA must be involved to perform qualifications for column attach- ment; it is a complex process. Starting from scratch, it might take
more than five years for alternative column attachment subcontractors to secure certifi- cation from the DLA. In March 2020, after the commencement of the COVID-19 pan- Continued on page 57
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