September, 2022
www.us -
tech.com
High Thermal Reliability BGA Spheres from SHENMAO
SAN JOSE, CA — SHENMAO America, Inc. is pleased to announce that the PF918-S lead-free BGA spheres features the newly designed high- reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy. A board-level thermal cycling test with an
automotive IC product showed that the ther- mal cycling life of PF918 is two times longer than the SAC305 alloy. The melting point of PF918 is in a similar range to SAC305. Worka- bility and reflow profile of PF918 are able to re- main the same as SAC305. PF918-S is formulated with
the new SHENMAO Sn/Ag4.0/ Bi3.0 alloy that is designed with high thermal impact reliability for long service life electronic products with high-reliability re- quirements. The lead-free BGA sphere
can increase thermal reliability performance by a minimum of 30 percent. It provides better me- chanical shock, tensile strength
nScrypt Patents Printed Litz Line
ORLANDO, FL — nScrypt’s re- search arm, Sciperio, has patent- ed a method of 3D printing litz lines, which are essentially wires made of individually insulated strands twisted or woven togeth- er. They are used in electronics to carry current at radio frequen- cies. Litz wire reduces resistance at higher frequencies. The patent covers a method
of printing an equivalent of a litz wire, using 3D printing, laser cutting, milling, etching, or masking. By printing multiple con-
ductive tracts in a pattern on a substrate, such as a bare die, the resulting printed litz line in- creases conductance compared to a single conductive line. The 3D printing process
may be material jetting or spray, material extrusion, dispensing (such as with nScrypt’s Smart- Pump™ microdispensing tool head), or other processes for ap- plying materials. The printed litz line may
have a thickness of less than 100µ, may be printed conformal- ly on a surface of any virtually any shape, and may extend
through vias. Contact: nScrypt, 12151
Research Parkway,
Suite 150, Orlando, FL 32826 % 407-275-4720 E-mail:
info@nscrypt.com Web:
www.nscrypt.com
Condenso series Vapor Phase Soldering
www.rehm-group.com See at SMTA Guadalajara, Booth 608 16:39:15 #VaporPhaseSoldering #Avionics
When soldering high-mass or large boards, a particularly effective and easily controlled soldering pro- cess is of great importance. With the vapor phase soldering systems of the Condenso series, you will succeed in achieving the best soldering results even with these requirements – for a good take-off and a safe landing.
8 processes with infinite possibilities!
and thermal cycling performances than typical solder alloys such as SAC305 and SAC405. PF918-S offers superior thermal cycling re-
liability performance suitable for automotive devices, high power components and advanced IC packages such as wafer-level chip scale packages (WLCSP) with high thermal reliabili-
ty requirements. Contact: SHENMAO America, Inc., 2156
Ringwood Avenue, San Jose, CA 95131 % 408-943-1755 fax: 408-684-5477
PF918-S lead-free BGA spheres.
E-mail:
usa@shenmao.com Web:
www.shenmao.com
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