September, 2022
www.us-tech.com
Silver-Free Thick Film Copper Bonds Reliable Metal-Ceramic Substrates
Continued from previous page
test for 1,000 hours at +347°F (+175°C) to stress the braze metal and prove that the brazing
Automotive SAN JOSE, CA — Yamaichi Electronics offers many different high-speed connectors. Among these are high-speed versions in the Y-Circ P product group of metallic push-pull circular con- nectors. In addition to the stan- dardized SPE versions, Yamaichi Electronics also offers customer- specific solutions based on these push-pull connectors with a high number of mating cycles. In an in-house laboratory
Yamaichi: Push-Pull Connectors for SPE and
Yamaichi develops, simulates and tests pin layouts for high- speed applications. The S1 pin layout enables the transmission of Single Pair Ethernet up to 10 Gb/s according to IEC 802.3ch and of Automotive Ethernet sig- nals according to the Open Alliance Standard TC9.
filler metal system is stable. No difference was observed between the initial status and the aged substrate after HTS.
Thermal Resistance Simulation
A thermal simulation was
performed to assess the influence of thermal conductivity and the thickness of the braze metal lay- ers in the substrate on its total thermal resistance. To include heat spreading and other geo- metrical effects, a Finite
Element Method (FEM) was applied. A simplified geometry of a
typical chip-substrate-setup was simulated, including the sub- strate itself, the braze metal lay- ers on each side of the cer - amic/copper interfaces, and a sil- icon chip with a sintered silver die attach. In the simulation, the chip
was heated by a constant power of 200W in its volume for 30s while the bottom of the substrate was kept at a constant tempera-
ture of +77°F (+25°C). The results of the simulation agreed with the experimental results. This demonstrates that nitride- based ceramic substrates can be bonded to copper without silver, and are up to the task of han- dling high power electronics applications. Contact: Heraeus, Inc.,
24 Union Hill Road, West Conshohocken, PA 19428 % 215-944-9981 E-mail:
jeffery.oddo@heraeus.c Web:
www.heraeus-electronics.com r
Page 59
When your name
means continuous improvement STAYING EDUCATED IS REQUIRED
Y-Circ P push-pull connector.
The combination of the reli-
able push-pull mechanism in small size 09 connectors and the innovative, patent-pending insu- lator and contact design offers highest data rates for special test and measurement applications with at least 5,000 mating cycles. The new S1 pole pattern is
available in straight and even angled device sockets, and Yamaichi Electronics can also assemble the matching connector directly with a cable suitable for SPE on request. Standardized SPE connec-
tors are also available from Yamaichi Electronics. They include both mating faces acc. to IEC 63171-2 and -6. SPE is a future oriented technology as preparation to industry 4.0. Contact: Yamaichi
Electronics USA, 475 Holger Way, San Jose, CA 95134 % 408-715-9100 E-mail:
info@yeu.com Web:
www.yeu.com
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