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www.us-tech.com
September, 2022
ACM Research Introduces New Post-CMP Cleaning Tool for Silicon and SiC Wafer Substrate Manufacturing
FREMONT, CA — ACM Research has intro- duced its new post-CMP cleaning tool. This is ACM’s first tool of its kind, serving as a cleaning step following the chemical mechan- ical planarization (CMP) process used to manufacture high quality substrates. It is available in 6- and 8-inch configurations for silicon carbide (SiC), and 8- and 12-inch con- figurations for silicon wafer manufacturing. The tool is available in wet-in dry-out (WIDO) and dry-in dry out (DIDO) configura- tions, with 2-, 4- and 6-chamber options to achieve maximum throughput of up to 60 wafers per hour (WPH). Following the CMP step, a physical pre-
clean process is needed to reduce the number of particles, using dilute chemicals at low temperatures. ACM’s post-CMP cleaning tool is available in multiple configurations, in-
cluding advanced cleaning technologies with ACM’s Smart Megasonix. The new WIDO online pre-clean tool at-
taches directly to an existing CMP tool. Wafers are automatically transferred into two brush chambers, where the front-side,
back-side and bevel edge are processed con- currently with chemical and cold deionized water (CDIW). Wafers are then moved to ei- ther two or four clean chambers and are processed with multiple chemicals and CDIW. A nitrogen (N2) dry and spin com- pletes the process. The new DIDO pre-clean tool is a stand-
alone tool with four loadports and a smaller footprint than the WIDO pre-clean tool, in- tended for customers whose CMP platforms have a built-in cleaning chamber such that wafers come out of the tool dry. In this configuration, wafers are manu-
ally transferred to the pre-clean tool via the load port, then processed identically to those in the WIDO pre-clean tool. The DIDO pre-clean tool is available in
ACM Ultra C post-CMP cleaning system.
Headquarters, Vista, California, USA. +1 (760) 438-1138 -
sales@visionpro.com
four- or six-chamber configurations, with two brush and two cleaning cham- bers or two brush and four clean- ing chambers. The DIDO pre- clean tool achieves the same metallic contamination results as the WIDO pre-clean tool while delivering throughput up to 60 WPH when using the six-cham-
ber tool. Contact: ACM Research,
42307 Osgood Road, Unit I, Fre- mont, CA 94539 % 510-445-3700 Web:
www.acmrcsh.com
Connectors CAMARILLO, CA — binder USA expands its portfolio of 7/8 in. ca- bles and cable connectors. These UL-certified products are ideal for supplying power to components and devices in process, factory, and warehouse automation appli- cations. Stainless steel cable connec-
tions are able to withstand corro- sive industrial environments. Usage examples include power supply to sensor-actuator boxes, drive and lighting technology, and heating devices. Cables are available field
wireable or ready to connect, pre- assembled, and overmolded. They are also compatible with products from different manufac- turers, per NFPA/T3.5.29 R1- 2007 standards. The selection also now ex-
tends to CAN-based DeviceNet fieldbus. This includes the binder 870 series T distributors in various pin counts, capable of supplying two loads simultane-
ously from a single source. Contact: binder USA, 3903
Calle Tecate, Camarillo, CA 93012 % 805-437-9925 E-mail:
sales@binder-usa.com Web:
www.binder-usa.com
binder USA Expands Cable and Panel Mount
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