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www.us-
tech.com
October, 2019 Finetech: Sub-Micron Accuracy from Lab to Fab
Amherst, NH — Finetech’s high-precision place- ment and assembly systems support customers in the photonics and optoelectronics industry from cost-efficient product development and transfer to automated manufacturing. With the newly intro- duced FINEPLACER® lambda 2 and the high-yield production platform FINEPLACER® femto 2, the machine manufacturer offers integrated equip- ment and process solutions for all product stages from a single source. As a manufacturer of microassembly equip-
ment and process technology, Finetech has been supporting startups, as well as global technology leaders, for almost three decades in the develop- ment of innovative semiconductor products. The highly accurate sub-micron placement
and assembly systems are a cornerstone of the Berlin-based mechanical engineering company’s
portfolio — valued worldwide as versatile, cost-effi- cient and compact bonding platforms for R&D, pro- totyping and automated production. They are a great choice for complex multistage
assemblies with extremely high accuracy require- ments, as well as diverse and very demanding bond- ing technologies. Applications include the develop- ment and production of optical transceivers up to 400G for data communication, environmental sen- sors for autonomous driving, or power laser modules for use in industrial and medical applications. For basic research, concept and prototype
FINEPLACER lambda 2 high-precision placement system.
phases, Finetech offers manual and partially motorized tabletop systems. The company recently presented a new version of its longstanding suc- cessful model, the FINEPLACER lambda. The FINEPLACER lambda 2 is used to place and connect components with an accuracy of better than 0.5 µm — suitable for high requirements in the development of optoelectronic prod- ucts, such as transceivers (TOSA/ ROSA) or laser diode modules. Due to a proven alignment and placement design with only one moving axis, the system combines high process quali- ty, stability and accuracy. In conjunc- tion with specially developed optical systems with optical resolutions down to 0.7 µm, it enables superim- posed images of the highest optical quality for the reliable detection and alignment of the finest structures in
the micron range. Contact: Finetech USA, 60 State
Route 101A, Building A, Amherst, NH 03031 % 603-627-8989 Web:
www.finetechusa.com
See at productronica, Hall B2 Booth 411
Industry Proven Suite of Solder Pastes from Indium
Selective Coating? Trust the Experts.
Global support and unparalleled application expertise that spans over 20 years and thousands of selective coating installations at the world’s largest manufacturers.
Clinton, NY — Indium is now offer- ing a proven suite of solder pastes designed for reliability. The compa- ny’s solder pastes have a track record of eliminating common industry defects and delivering the reliability necessary for the assembly chal- lenges of today and tomorrow. Indium Corporation’s solder
pastes, including Indium8.9HF, are specially formulated to deliver all- around reliability through ultra low- voiding, plus enhanced benefits such as improved response-to-pause, sta- bility, head-in-pillow minimization, elimination of dendritic growth, non- wet open resistance, and enhanced solder beading performance. Indium8.9HF exceeds
all
requirements for enhanced electrical reliability. It also provides low void- ing on bottom termination compo-
nents with no dendritic growth. Contact: Indium Corp., 34
Robinson Road, Clinton, NY 13323 % 315-381-7524
Visit us in Hall A2 Booth 253 Visit us in Booth 400
E-mail:
abrown@indium.com Web:
www.indium.com
See at SMTA Guadalajara, Booth 609, and productronica,
Hall A4 Booth 214 See at productronica, Hall A2 Booth 253, The ASSEMBLY Show, Booth 400 and SMTA Guadalajara, Booth 423
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