October, 2019
www.us-
tech.com
Page 25
Nihon Superior Launches Latest Flux-Cored Solder
Osage Beach, MO — Nihon Superior has introduced its TipSave N flux- cored solder wire. The company’s SN100C has been widely accepted as a leading lead-free soldering alloy since it was invented by Nihon Supe- rior’s president Tetsuro Nishimura. The silver-free SN100C alloy delivers a stable microstructure in an alloy that can accommodate the long-term cyclic strains and impact loading to which a solder joint may be subjected. The micro-addition of nickel en-
hances the performance of SnCu re- sulting in smooth and bright fillets
Technic Offers Advanced Gold-Tin Electro plating
Cranston, RI — Technic is reporting increased market demand of its ad- vanced gold-tin electroplating process, Elevate® AuSn 8020. The company attributes the increased de- mand to a significant expansion in the manufacture and use of 5G capa- ble wireless devices, LiDAR remote sensing technology, and data center interconnect (DCI) technology. Due to advances in 5G, LiDAR,
and DCI, requests for high-reliability solder that meets new manufactur- ing requirements have surged sub- stantially. Gold-tin solder has be- come the standard in integrated pho- tonic interconnections due to several unique properties that make it an ex- cellent process. These include favor-
with few shrinkage defects and a sta- ble microstructure with minimal growth of the interfacial intermetallic, ensuring highly reliable solder joints. The newly developed TipSave N
flux-cored solder wire extends solder- ing iron tip life by 3 times. Paired with the (032) no-clean, halogen-free cored-flux, it provides fast wetting and low spattering. TipSave N is a good match for hand soldering, as well as continuous robotic soldering as it reduces required soldering tip change overs, increasing production while reducing cost.
SN100CVTM P608 D4 is a com-
pletely halogen free, lead-free, no- clean solder paste. Unlike silver-con- taining alloys that derive their strength from a dispersion of fine
particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The paste provides excellent wetting and
reduces voiding. Contact: Nihon Superior USA,
TipSave N flux-cored solder wire.
LLC, 1395 Hawk Island Drive, Osage Beach, MO 65065 E-mail:
k.howell@
nihonsuperior.co.jp Web:
www.nihonsuperior.com
Growth of 5G, DCI and LiDAR is driving demand for gold-tin electroplating.
able soldering temperatures of 572 to 590°F (300 to 310°C), high strength, fluxless assembly, and optimum wet- ting performance. Technic attributes a number of
factors responsible for making the Elevate AuSn 8020 process a clear choice for gold-tin deposition. First, Elevate AuSn 8020 deposits alloy at and near the eutectic of 80 percent Au, 20 percent Sn from a single solu- tion. Second, the process offers a cost-effective alternative to other in- dustry-standard solder deposition processes, such as preforms and evaporation. Finally, unlike other gold-tin deposition processes, Ele- vate AuSn 8020 does not have any
feature or thickness limitations. Contact: Technic, Inc., 47 Molter
Street, Cranston, RI 02910 % 401-785-8763
E-mail:
bsheeran@technic.com Web:
www.technic.com
See at productronica, Hall A1 Booth 151 and SMTA Guadalajara, Booth 127
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112
