October, 2019
www.us-
tech.com Modifying Wet Process Cleaning Equipment
to Maximize Automation Benefits Continued from previous page
Bertagnolli cautions, however, that not every
project needs to be fully customized from the ground up. Quite often standard automation plat- forms can be customized according to length and height and number of baths. Cleaning process de- sign engineers can consult with automation suppli- ers to determine where to put the transfer system and what automation modules will fit best in the space available. “Unlike proprietary platforms that do not
allow modification, the best platforms are tried and true, but offer a range of options that utilize the same motors, actuators, and automation in an inter- changeable way,” says Bertagnolli. “This allows flexibility while minimizing cost and complexity.” This type of an approach can be successfully
utilized in fully automated, special project and semiautomated cleaning processes.
Fully Automated Stations. Semi to fully automated, multitask cleaning stations utilize at least four baths. Such stations use robotics to pick up and drop off product at the baths as required, while following prepro- grammed recipe sequences. However, the stations often need to be modified to operate most efficiently. In order to allow for modifica-
tion, cleaning specialists like JST offer multiple automation platforms that can accommodate various space constraints. The company can also tailor loading to the specific task by utilizing front, rear, or overhead ro- bots with either front or side loading. Optional turntables can enable er- gonomic side loading as well as rear access for ease of maintenance as well.
“For automated stations, the
number of tanks, robot location, movement speed, loading, as well as sizing of everything, is based on the specific requirements,” says Bertag- nolli.
In regards to modifying such au-
tomated cleaning systems, the com- pany works closely with automation partners, such as Bosch Rexroth, to develop cleaning stations using lin- ear motion and electric drive and con- trol technology. Recently, the two companies
worked together to create an auto- mated system for cleaning silicon chunks to the extreme purity of 11N to meet requirements for the manu- facture of semiconductor chips. The project entailed building a cleaning line 138 ft (42m) in length and incor- porating multiple gantry robots.
Special Automated Projects.
When automated cleaning and strip- ping of wafers, optics, disk drives, flat panels, and other delicate parts is re- quired for special projects, equipment is available that operates on a com- pletely self-contained, dry-to-dry basis. One such unit is JST’s 300 CLV
cleaner and stripping tool. Once prod- uct is placed in the dry tank, the unit can process through either single or multiple chemical processes, rinse and dry according to a prepro- grammed recipe without operator in- tervention or mechanical moving parts to maintain. As an example, the National Ig-
nition Facility (NIF) at Lawrence Livermore National Laboratories (LLNL) has utilized such a tool. NIF, the world’s highest-energy laser sys- tem — a stadium-size machine — con- sists of 192 laser beams that will focus nearly two million joules of en-
Patented
selective soldering technology that
excels at meeting the challenges of miniaturization.
Meet with ZEVAm+
technical experts and engineers at Productronica
Together in Process Perfection
ITW EAE brings together the world-leading brands of electronics assembly equipment. The combined knowledge and experience of the ITW EAE group is driving the development of next generation technology like the ZEVAm+ Selective Soldering System and the MPM Momentum II Printer line. We are committed to high-quality products backed by application and process expertise. We will help optimize your equipment for maximum performance and improved productivity and yield.
Come see all our latest developments at Productronica Booth A4 554
ergy and create temperatures and pressures that exist in the cores of stars and giant planets. One of the innovations in the NIF cleaning
tool, utilized in a tank-like configuration and de- signed to clean up to 300-pound laser optics, was eliminating the need to move the optics to different locations in order to perform the washing, rinsing and drying functions.
Semiautomated Systems. Many processors with lower-volume throughput requirements might con- sider using semiautomated cleaning systems. Compared with manual systems, these provide better repeatability, faster production and added safety. This type of cleaning system is appropriate for MEMs, LEDs and silicon applications. It is compact, software-controlled and usually easy to service.
JST manufactures a standard compact semi-
automated wet bench called the Tigress, a two- axis, front-to-back system that is used by smaller semiconductor companies. A dual version of this system is also available. It is popular among semi- conductor manufacturers who use it for cleaning, stripping and etching of semiconductor substrates when cleaning acids, bases or solids used to re- move photoresists. “While design engineers may be resigned to
using standard, automated wet process cleaning equipment, tailoring options to the project can sig- nificant enhance quality, production and safety, while actually cutting cost,” concludes Bertagnolli. Contact: JST Manufacturing, Inc., 219 E.
50th Street, Boise, ID 82714 % 208-377-1120 fax: 208-377-3645 E-mail:
info@jstmfg.com Web:
www.jstmfg.com r
Page 31
Momentum II Printers
A proven, highly-productive printer platform now with a set of new exciting technologies.
NEW
Learn more at
www.itweae.com
A division of Illinois Tools Works See at productronica, Hall A4 Booth 554
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108 |
Page 109 |
Page 110 |
Page 111 |
Page 112
