October, 2019
www.us-
tech.com
Page 83 Henkel Offers High-Rel Aerospace Materials
Irvine, CA — Henkel is now offering a wide range of advanced formula- tions for today’s electronics assem- blies. The company’s LOCTITE® ABLESTIK CF 3366 high-reliability assembly film is a silver-filled, epoxy-based assembly film designed to provide strong adhesion to facili- tate RF ground plane performance, even during long-term exposure to elevated temperatures. Henkel’s high operating tem-
Spectra-Tech Partners withMIRTEC
Continued from previous page
tified processes include qualification of suppliers, incoming and in-process inspections, AOI, planned mainte- nance, failure analysis, and IPC-cer- tified personnel. Being committed to continuous
improvement, Spectra-Tech has developed a quality management system that provides a framework for measuring and improving its per- formance. To obtain customer satis- faction and continuous improvement the company: conducts periodic audits of its internal processes; trains and develops of each employee (IPC- A-610 and J-STD-001); selects and monitors suppliers; measures quality objectives; identifies improvement opportunities; and performs cus- tomer satisfaction reviews. MIRTEC focuses heavily on
continuous improvement with the purpose of constantly increasing the value of the products and services it provides to its customers. The com- pany’s business philosophy states, “We provide our customers with the highest-quality products and servic- es at competitive pricing. We recog- nize that our customers are the source of our future growth and as such we strive for a strong, reliable and long-term partnership based on trust and respect. We listen to their needs and deliver prompt service. We consistently work to meet and try to exceed their expectations. We aim to bring positive changes to their business. In short, our ulti- mate objective is the absolute suc- cess of our customers.” “We understand that electron-
ics manufacturers are becoming ever more selective in purchasing equipment that will add value to their businesses and provide them with a much needed edge in this highly competitive industry,” con- tinues D’Amico. “With this in mind, an increasing number of manufac- turers are relying upon 3D AOI equipment to help increase prof- itability by improving production yields and reducing costly rework. Contact: Spectra-Tech
Manufacturing, Inc., 14013 Borman Drive, Batavia, OH 45103 % 513-735-9300 Web:
www.spectratechmfg.com and MIRTEC Corp., 3 Morse Road, Oxford, CT 06478 % 203-881-5559 fax: 203-881-3322 E-mail:
bdamico@mindspring.com Web:
www.mirtec.com r
See at productronica, Hall A2 Booth 413
See at productronica, Hall A3 Booth 341
perature compatible underfill, LOC- TITE ECCOBOND UF 1173 protects array devices in a formulation that is compatible with applications where higher temperatures are the norm. Smaller, high-functioning devices
and the use of new high thermal chip structures within the aerospace sector present challenges when it comes to management of the increased thermal load. Conventional soft solders and many adhesives cannot handle operat- ing temperatures as high as 392°F (200°C). Semi-sintering sintering paste, LOCTITE ABLESTIK ICP 9000,
offers a lead-free interconnect solution compatible with these demanding con- ditions. Henkel’s new low-modulus, low-
CTE liquid compression molding (LCM) and printable encapsulating materials allow fan-in and fan-out wafer-level packages (WLPs) and wafer-level
ing, and LOCTITE ABLESTIK EMI 3620FA, a component isolating paste for integrated packages, can be used in combination or as standalone solu- tions for an effective alternative to conventional EMI approaches. Contact: Henkel Corp., 14000
chip-scale packages
(WLCSPs) to be processed with mini- mal warpage for high reliability. Integration and miniaturization
have driven the development of Henkel’s package-level EMI shield- ing solutions. LOCTITE ABLESTIK EMI 8880S, a conductive spray coat-
Jamboree Road, Irvine, CA 92606 % 714-368-8000 E-mail:
hui-ling.parker@
henkel.com Web:
www.henkel.com
See at The ASSEMBLY Show, Booth 2006, and productronica,
Hall A5 Booth 181
Dreaming of a zero-defect future? We help you get there.
In tomorrow’s intelligent factory, product quality is fully within your control. With Vi TECHNOLOGY’s fl eet of state-of-the-art inspection solutions, the actionable information you need to boost yield, quality and repeatability is never more than a few clicks away. Thanks to a combination of high-precision metrology and powerful process management tools, you can predict and prevent more defects, and get paid for more boards at the end of every day. Visit booth A3 341 at Productronica to learn how our fully integrated 3D SPI and AOI solutions help put the future in your control.
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