March, 2019
www.us-
tech.com
Page 89
Irvine, CA — Menlo Micro has successfully ported its digital-micro-switch (DMS) technol- ogy platform, moving it from an R&D facility to a commercial 8 in. (20.3 cm) wafer manufac- turing line. In partnership with Corning Incorporated
DSM Technology Commercially Available from Menlo Micro
and Silex Microsystems, Menlo is now sam- pling product from the new line and will begin scaling up the production of micromechanical switches before the year’s end. Having already shipped over 100,000
production units from its existing manufac- turing line, this new milestone puts Menlo in a position to significantly scale up its manu- facturing and business operations and allows for the proliferation of its high-performance RF and power products into a broader array of markets. Menlo plans to use this ad -
vanced manufacturing capability to produce micromechanical switches that will bring step-function im - provements in performance for sys- tems in medical equipment, military communications, test and measure- ment instrumentation, industrial automation, 5G communications net- works, and more. Innovations in advanced alloys,
ADLINK: Latest COM Express Type 6 Module
San Jose, CA — ADLINK has intro- duced its latest COM Express Type 6 modules, widening its offerings to meet the most performance-demand- ing applications. ADLINK’s Express- CF modules contain Intel® Xeon® and eighth-generation Intel Core™ processors with up to six cores and 48 GB of memory. According to the com- pany, these modules are the first to support both Xeon and Core™ i7 hexa-core CPUs. ADLINK’s Express-CF provides
standard support for up to 48 GB non-ECC DDR4 in three SO-DIMMs (two on the top side and one on the bottom), while still complying fully with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon hexa-core processor support both ECC and non-ECC SO- DIMMs. With integrated Intel UHD
Graphics 630, the Express-CF sup- ports up to three independent dis- plays through DisplayPort, HDMI, DVI, and LVDS connectors. The com- pany also offers either eDP or analog VGA as build options by customer request. The Express-CF also sup- ports Intel Optane™ memory and NVME SSDs, through high-speed PCIe x4 Gen3 interfaces, allowing applications access to the highest speed storage solutions currently
available. Contact: ADLINK Technology, Inc., 5215 Hellyer Avenue, Suite
110, San Jose, CA 95138 % 408-360-0200 E-mail:
info@adlinktech.com Web:
www.adlinktech.com
processing and packaging have allowed the company to shrink the size of its products by more than 60 percent, when compared with previous generations. Menlo’s materi- al science breakthroughs have also enabled a simplified manufacturing flow, representing a 30 to 40 percent reduction in manufacturing steps over typical CMOS processes. This sim- plification helps to reduce manufacturing costs. Together, these advancements play a key role in Menlo’s vision of reducing the size, weight and power consumption of critical elec-
tronic systems. Contact: Menlo Micro, 49 Discovery,
Menlo has ported its DMS wafer manufacturing technology from R&D to commercial production.
Suite 150, Irvine, CA 92618 % 949-771-0277 Web:
www.menlomicro.com
See at APEC, Booth 1138
The right solutions happen when you care enough to ask the right questions.
AQUANOX® A4727 NEW member of the AQUANOX family
At KYZEN, we have the SCIENCE and expertise to solve any cleaning problem, and the CARE to find the perfect solution for your individual cleaning process. When science and care converge, your cleaning process succeeds on every level.
Want to know more? Go to
KYZENCleans.com
KY Z E N . C OM WORLDWIDE ENVIRONMENTALLY RESPONSIBLE CLEANING TECHNOLOGIES
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108
