March, 2019
Stuttgart, Germany — SMTconnect, formerly known as SMT Hybrid Packaging, is set to take a holistic approach to microelectronic assem- blies and systems —from development and production to service. In 2019, the event is being presented under its new name, along with many developments. SMTconnect is scheduled to be held from May 7 to 9 at the Nürnburg - Messe in Nuremberg, Germany. The trade show’s new name
keeps its main subject and features recognizable, but is meant to reflect the needs of
the community.
“SMTconnect” underlines the fact that the show attracts the entire SMT com- munity, including users, suppliers, service providers, and clients, and offers time and space for them to exchange ideas and products. The show’s motto has been
updated to “Solutions for electronic assemblies and systems.” Changes have also been made to the look of the event, freshening up this year’s appearance. With the goal of reach- ing new target groups and providing the community with more opportuni- ties to connect and overcome the challenges faced by the industry, SMTconnect will be proactively ad -
SEMI: 2019 FLEXI Award Winners
Continued from previous page
butions to the FLEX conference, including participating in calls for abstracts, leading a tech course and serving on every SEMI-FlexTech committee. The “Industry Leadership Award”
was given to Keith Rollins, formerly with DuPont Teijin Films, for his ded- ication and work to commercialize flexible electronics materials. Rollins served as volunteer chair of the UK Plastic Electronics Leadership Group and a member and chair of the SEMI- FlexTech governing council. “I’m honored to receive this
award and privileged to have seen the flexible and hybrid electronics market develop in so many exciting direc- tions,” said Rollins. “Many thanks to both my colleagues in the global DuPont Teijin Films business for their outstanding contributions to this industry and to the leadership and staff of SEMI-FlexTech for mak- ing my work with them so rewarding.” SEMI® connects more than
2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for innova- tions in materials, design, equip- ment, software, devices, and services that enable smarter, faster, more powerful, and more affordable elec- tronic products. Electronic System Design
Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined com- munities within SEMI focused on specific technologies. Contact: SEMI, 673 South
Milpitas Boulevard, Milpitas, CA 95035 % 408-943-6900 fax: 408-943- 6986 Web:
www.semiconwest.org r
www.us-
tech.com
dressing prominent topics. This includes a new staging of electronic manufacturing services in a show- case area named “EMS Park.” EMS Park will have a natural
and open design, plants and benches to offer relaxed yet efficient network- ing opportunities. This new area makes it easy for exhibiting compa- nies to make contact with their tar- get groups among the numerous visi- tors, such as those from the medical, automotive or mechanical engineer- ing fields. Alongside the exhibition, the
trade show’s new Technology Days will focus on the mounting and connec- tion of components and assemblies in
a wide variety of application areas. The three main tracks will include 20 sessions: soldering — challenges in practice; substrates —important carri- ers for components; and successful adhesives in electronics. SMTconnect will also attract vis-
itors with its many highlights. The “Future Packaging” production line, organized annually by Faunhofer IZM, will revolve around the topic, “Get in the Ring — Challenges for Modern Manufacturing.” Soldering professionals and
young professionals will have the opportunity to demonstrate their skills at the annual hand soldering competition organized by the world-
Page 105 SMTconnect Includes New Area for EMS Partners
wide trade and standardization organization IPC — Association Connecting Electronics Industries. In addition to the EMS Park,
there will be other joint stands, includ- ing “PCB Meets Components,” “Clus - ter Mechatronics and Automation,” “Newcomer’s Pavilion,” and this year’s new “Startup Area,” organized in coop- eration with VDMA Electronics, Micro and Nano Technologies Association and the VDMA Startup Machine. Contact: Mesago Messe
Frankfurt GmbH, Rotebühlstr. 83-85, 70178 Stuttgart, Germany % +49-711-61946-0 E-mail:
info@mesago.com Web:
www.smt.mesago.com r
The
Leadership Summit
MAY 7–10, 2019 ° MIRAGE ° LAS VEGAS
Four days where leaders, innovators and other bright minds connect, share, inspire and collaborate. The EDS Leadership Summit is not just about building business; it’s also elevating the discussion with ideas that drive the electronic components industry to the next level.
Register today at
edsconnects.com.
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