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March, 2019 Heller Launches High-Throughput Reflow Oven
Florham Park, NJ — Heller’s new MK7 reflow oven platform incorpo- rates all of the company’s customer requests for lower Delta T, reduced nitrogen consumption and extended PM into a new, low-height package that makes it easy to see across the production floor. The company is able to run pro-
files and gather data for customers at its three locations. Customers can send boards and Heller will run pro- files and generate data. The company works with clients to configure cus- tom systems to suit their needs. Features of the new oven in-
clude: high yields; low Delta T on the board; low nitrogen and electrical usage; no maintenance; low voiding
Heller MK7 convection reflow oven. with vacuum option; Industry 4.0-
compatibility; and integrated Cpk software at no charge. The oven’s low-height top shell
provides easy access for operators. All skins have double insulation to
save up to 15 percent in energy costs. The oven is also able to network with other machines in the smart factory. Its enhanced, low-height, heater module provides low Delta T on the product with excellent airflow and
uniformity. The uniform gas man- agement system eliminates “net flow,” resulting in nitrogen consump- tion reductions of up to 40 percent. The new semicircular heater is more robust and efficient with a much longer lifetime. A flux collection system traps
flux in collection jars that can be re- moved easily and replaced while the oven is running, saving time-con- suming PM. The new flux filtration box also has no risk of flux clogging for a longer-term PM interval. The company’s proprietary, flux-free grill system limits the flux residue on the cooling grills, boosting production yields. The company’s Big Flat Coil
Cooling Module provides cooling rates of greater than 5.4°F/s (3°C/s) to meet demanding lead-free profile requirements. The oven can also achieve the slow cooling rates re- quired by flip chip processes. The oven’s design, which uses a 10 in. (25.4 cm) long heater module, pro- vides more modules in the same heating length, offering greater process control and reduced liquid times.
Contact: Heller Industries, 4
Vreeland Road, Florham Park, NJ 07932 % 973-377-6800 E-mail:
info@hellerindustries.com Web:
www.hellerindustries.com
ITW EAE: Interface Solutions for Industry 4.0
Minneapolis, MN — ITW EAE has worked with the world’s leading manufacturers to develop equipment that addresses evolving technical challenges, such as miniaturization, while also meeting the need for high- er throughput, yield and perform- ance. Key interface solutions have been developed for Industry 4.0/MES that can lead to improvements in yield, data collection and overall equipment effectiveness. Electrovert has also introduced
its DwellFlex 4.0 variable contact wave solder nozzle. The DwellFlex 4.0 is the first nozzle designed specif- ically with Industry 4.0 automation in mind. The patent-pending design enables the wave width to be adjust- ed on the fly as variable board types are run through the wave. This en- sures solder contact time is opti- mized for a greater mix of board types without changing conveyor speeds. ITW EAE provides process
knowledge, services and manufactur- ing of capital equipment used in the PCB assembly and semiconductor in- dustries. The group brings together the following brands: MPM printers, Camalot dispensers, Electrovert cleaners and soldering solutions, Vit- ronics Soltec soldering solutions, and Despatch thermal processing tech- nology.
Contact: ITW EAE, a division of
Illinois Tool Works, 8860 207th Street West, Minneapolis, MN 55044 % 952-469-8278 E-mail:
roger.dullinger@itweae.com Web:
www.itweae.com
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