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March, 2019
Sustainable 3D-Printed Electronic IoT Sensors
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Continued from page 1
be collected in a much easier way.” Kim’s research program spans
two international collaborative proj- ects, including the latest focusing on the eco-friendly, cellulose-material- based, chemical sensors with collabo- rators from the Swiss Federal Labo- ratories for Materials Science. He is also collaborating with a
team of South Korean researchers from the Daegu Gyeongbuk Institute of Science and Technology’s (DGIST) department of robotics engineering, and PROTEM Co. Inc., a technology- based company, for the development of printable conductive ink materials. In this second project, the re-
searchers developed a new break- through in embossing process tech-
nology, one that can freely imprint fine circuit patterns on flexible poly- mer substrates. Embossing technology is ap-
plied for the mass imprinting of pre- cise patterns at a low unit cost. How- ever, Kim says it can only imprint circuit patterns that are imprinted beforehand on the pattern stamp, and the entire, costly stamp must be changed to put in different patterns. The team succeeded in develop-
ing a precise location control system that can imprint patterns directly, resulting in a new process technolo- gy. This will have widespread impli- cations for use in semiconductor processes, wearable devices and the display industry. Web:
www.sfu.ca r
Gearing up for 5G: Mini, Low-Cost Transceivers
Tokyo, Japan — Researchers at Tokyo Institute of Technology (Tokyo Tech) have designed a 28 GHz trans- ceiver that integrates beamforming with dual-polarized multiple-input and multiple-output (MIMO) tech- nology. Measuring just 0.12 x 0.16 in. (3 by 4 mm), this tiny transceiver could help improve performances of fifth-generation cellular network (5G) and Internet of Things (IoT) de- vices.
A team of researchers led by
Kenichi Okada at Tokyo Tech’s De- partment of Electrical and Electronic Engineering has devised a strategy with a clear eye on supporting high- speed mobile data access using the millimeter-wave spectrum for 5G, the highly-anticipated wireless net- work of the near future. The combination of beamform-
ing and dual-polarized MIMO capa- bilities allows the transceiver’s array
of antennas to respond to both hori- zontal and vertical radio waves at the same time. Preliminary testing showed that the maximum data rate achieved was 15 Gb/s in the 64-QAM format. This data rate is 25 percent greater than that achieved by previ- ous comparable devices. As a continuation of Okada and
his group’s work on developing top-lev- el transceivers using minimal compo- nents, the researchers achieved a de- sign that is only millimeters in size, around half the size of anything achieved to date. The smaller the chip, the better for 5G, owing to the antici- pated demand for high-performance, area-efficient transceivers for use in tiny and portable sensors and devices. “Compared with the conven-
tional switch-based, bidirectional ap- proach, our bidirectional amplifier completely shares the inter-stage matching networks between the transceiver and the receiver. Thus, the required on-chip area is further minimized,” Okada explains. Web:
www.titech.ac.jp r
Contents SCS PRECISIONCOAT V
Tech-Op-Ed ........................... 4 Tech Watch ........................... 10 People.................................... 12 Business News......................... 14 Business Briefs........................ 15 Management......................... 16 EMS .................................... 18 ElectronicMfg. Prods............. 24 Production............................ 52 Partnering............................. 54 Distribution........................... 56 New Products....................... 94 High-Tech Events................... 104 Editorial Calendar................. 104 Advertisers Index................... 106
Special Focus: Inspection and Test.................... 58 Product Preview: APEC......................................... 74
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