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March, 2019


www.us- tech.com


Page 75 Henkel Develops Low-Voiding Solder Paste


Irvine, CA — Henkel Corporation has expanded its LOCTITE® GC solder portfolio with the introduc- tion of its latest LOCTITE GC 18 solder paste. The new material


stable for one year when stored at 79.7°F (26.5°C) and for one month at temperatures up to 104°F


is a low-voiding formulation


designed for use with multiple component sizes and types, including large, thermally challenged devices, such as MOSFETs, LPBGAs, QFNs, and large-array components. Available in Type 3 and Type 4 pastes, halogen-free and lead-free LOC- TITE GC 18 provides the comprehensive tempera- ture stability benefits inherent with the LOCTITE GC platform, delivering sustainability, reliability and a low cost of ownership. LOCTITE GC 18 exhibits low voiding with


diverse components, including 008004 (0201 met- ric) chip resistors and capacitors, 0.02 in. (0.4 mm) pitch BGAs, SOICs, QFPs, and QFNs, measuring greater than 0.4 x 0.4 in. (1 x 1 cm). The material’s voiding performance has been vali- dated with various surface finishes, board sizes, components, atmos- pheres, reflow profiles, and reflow ovens. Notably, the material exhibits low voiding results with reflow in air — a capability that allows assembly specialists to further reduce opera- tional expenditures by reducing nitrogen use. Consistent with other LOCTITE GC formulations, LOCTITE GC 18 is


New England Wire Tech: Maximizing Cable Q Factor


Lisbon, NH —With over 120 years of experience in Litz wire design, New England Wire Technologies (NEWT) is able to help customers maximize the quality factor, or “Q,” of cables. Using proprietary design techniques and constructions, leading industry


S  High-end selective soldering system to


integrate into in-line manufacturing concepts  Product change without downtime


 VERSAFLEX solder module x/y/z-variable  Parallel process through separation


of fluxing, preheating and soldering cycle  Use of up to 4 flux spray heads with


two independent axes (2 spray heads per axis)  Max. PCB size 680 x 610 mm (option 1,200 x 610 mm)


 VERSACAM for solder wave height measurement on the fly  Flexible system configuration


on account of modularity of the design


 Highly efficient 800 W hybrid heating head  Large-area IR Matrix bottom heater


with 25 single heating elements (600 W each)  Process observation with up to 8 thermocouples


 Automatic and precise component alignment with the help of machine vision


 Highly accurate, motor-driven axis system for component placement (+/- 0.025 mm)


 User independent, reproducible repair results guaranteed


 Process control and documentation via the operator software HRSoft 2


Henkel's LOCTITE GC 18 exhibits low void- ing, even when reflow soldered in air.


after four hours of abandon time, LOCTITE GC 18 is formulated for excellent transfer efficiency and is compatible with challenging surface finishes, such as OSP-, nickel- and zinc-coated copper, and


(40°C). The enduring material consistency pro- vides benefits across the value chain, from trans- port to on-site warehousing to production, allowing resource optimization, excellent in-process per- formance and the ability to source a single materi- al for a wide spectrum of product builds. With high Cpk during continuous printing and


HASL. Contact: Henkel Electronic Materials, LLC,


14000 Jamboree Road, Irvine, CA 92606 % 714-368-8000


E-mail: juan.serrano@henkel.com Web: www.henkel-northamerica.com


See at APEC, Booth 446


Think BIG! – And be prepared for the future


Ersa VERSAFLOW 4 XL designed for PCB sizes of up to 610 x 1,200 mm


Ersa HR 600 XL automatic rework on large assemblies


TRUE-Q Litz wire.


manufacturers have achieved their high Q factors when using NEWT’s TRUE-Q™ Litz wire, with improve- ments of two or even three times the Q of other materials. Using custom-formed geome-


tries to maximize density in tight locations, TRUE-Q is well-suited for use in wireless power transfer appli- cations around 90 kHz, as well as in


a variety of other applications. Contact: New England Wire Technologies, 130 North Main


Street, Lisbon, NH 03585 % 603-838-6624 E-mail: info@newenglandwire.com Web: www.newenglandwire.com


See at APEC, Booth 453 08:36:26 VERSAFLUX SELECTIVE FLUX MODULE


Simultaneous fluxing and soldering on PCB panels in x- or y-direction


Kurtz Ersa, Inc. 1779 Pilgrim Road Plymouth WI 53073 | USA Phone: +1 920 893 1779 Fax: +1 920 893 1562 selective.info@kurtzersa.com rework.info@kurtzersa.com


Kurtz Ersa México, S.A. de C.V. | Mexico Kurtz Ersa Asia Ltd. | China Ersa Hong Kong | China Ersa Shanghai | China Kurtz Ersa | France Ersa GmbH | Headquarters | Germany Kurtz Ersa Vietnam Company Limited | Vietnam


Ersa HRSoft 2 software package for HR 600 XL


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