Page 22
www.us-
tech.com Nano Manufacturing and R&D By Ed Sullivan A
s the market for nanotechnolo- gy and MEMS solutions contin- ues to ramp up, the rate of or-
ganizations seeking to get involved with this sector is also burgeoning. Yet, there are still significant chal- lenges that are, in many cases, posing difficulties in entering this market. For example, many developers
who would like to enter the MEMS or nano field lack the resources, includ- ing development time and equip- ment, to do so. Also, specialized pack- aging in these areas, which requires simultaneous contact with its own environment while being isolated from other environments, is often ex- pensive and difficult. “MEMS research and manufac-
turing organizations are meeting those challenges in unique ways,” says Louise Bertagnolli, president of JST Manufacturing, a specialist in wet processing equipment for the MEMS, nano, photovoltaic, wafer, and related industries. “An increas- ing number of universities and insti- tutions offer the facilities, including equipment and instrumentation, to conduct MEMS and nano research and even produce prototypes and modest production runs.” Wet processing systems, one of the areas that organizations focus
C
their attention on, are used for such procedures as etching, photoresist wet stripping, photolithography, metal lift-off, and related polymer re-
such as the screen rotation of today’s cell phone displays and the optical switches and mirrors to redirect or modulate light beams. Future appli-
available to both educational and commercial researchers. The Univer- sity of Michigan’s Lurie Nanofabrica- tion Facility (LNF) is one example. Michigan’s facility works in all
areas of semiconductor device and cir- cuit fabrication, integrated microsys- tems and MEMS technologies, nan- otechnology, nanoelectronics, nano - pho tonics and nanobiotechnology. It is an open-use facility with hundreds of users from various departments, as well as many other universities and businesses. According to Dennis M. Schwei -
ger, senior director of infrastructure, soliciting the opinion of equipment manufacturers regarding equipment design for such facilities can be high- ly beneficial. “It is important to our diverse
JST Manufacturing’s applications laboratory.
moval processes. Those processes aid researchers
4:53 PM Page 1
and manufacturers in improving product quality and throughput in a wide range of MEMS and nano appli- cations, such as microsensor- and mi- croactuator-based devices. Some of these capabilities are used in contemporary applications
cations will provide complete “sys- tem-on-a-chip” capabilities.
Making Research More Available
Although the cost of MEMS and
nano application development can be very expensive, some institutions are installing facilities and making them
users that we provide them with wet processing equipment that suits their purposes well due to the fact that we essentially rent the lab space and equipment needed,” says Schweiger. The original equipment design
for the new lab area’s wet processing benches was very specific and deter- mined by the LNF staff. “When we first started out, we looked at it in terms of process flow and didn’t take into ac- count the variety and variation of
Continued on next page
Determining Wet Processing Parameters for MEMS,
March, 2019
Metals Waste Recycling That Pays You Back!
At Conecsus, we’re dedicated to responsible recycling, reuse, and re c o v e ry of metal-bearing wastes fro m SMT/PCB manufacturing. We are the largest secondary tin-lead recycler in the western hemisphere with s t a t e -of-the-art technology and a world-class staff of highly trained metallurgists.
Best of all, we pay top value for your waste, Waste we recycle includes tin/lead and lead-fre e solder dross, solder paste scrap, wire, SMT stencil wipes, and more.
We have programs that fit your needs no matter what your company’s size, and we are committed to providing the best service in the industry.
Learn more; visit
www.conecsusllc.com today!
Page 1 |
Page 2 |
Page 3 |
Page 4 |
Page 5 |
Page 6 |
Page 7 |
Page 8 |
Page 9 |
Page 10 |
Page 11 |
Page 12 |
Page 13 |
Page 14 |
Page 15 |
Page 16 |
Page 17 |
Page 18 |
Page 19 |
Page 20 |
Page 21 |
Page 22 |
Page 23 |
Page 24 |
Page 25 |
Page 26 |
Page 27 |
Page 28 |
Page 29 |
Page 30 |
Page 31 |
Page 32 |
Page 33 |
Page 34 |
Page 35 |
Page 36 |
Page 37 |
Page 38 |
Page 39 |
Page 40 |
Page 41 |
Page 42 |
Page 43 |
Page 44 |
Page 45 |
Page 46 |
Page 47 |
Page 48 |
Page 49 |
Page 50 |
Page 51 |
Page 52 |
Page 53 |
Page 54 |
Page 55 |
Page 56 |
Page 57 |
Page 58 |
Page 59 |
Page 60 |
Page 61 |
Page 62 |
Page 63 |
Page 64 |
Page 65 |
Page 66 |
Page 67 |
Page 68 |
Page 69 |
Page 70 |
Page 71 |
Page 72 |
Page 73 |
Page 74 |
Page 75 |
Page 76 |
Page 77 |
Page 78 |
Page 79 |
Page 80 |
Page 81 |
Page 82 |
Page 83 |
Page 84 |
Page 85 |
Page 86 |
Page 87 |
Page 88 |
Page 89 |
Page 90 |
Page 91 |
Page 92 |
Page 93 |
Page 94 |
Page 95 |
Page 96 |
Page 97 |
Page 98 |
Page 99 |
Page 100 |
Page 101 |
Page 102 |
Page 103 |
Page 104 |
Page 105 |
Page 106 |
Page 107 |
Page 108
