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March, 2019


www.us- tech.com


Insight SiP Launches Miniature BLE Module with Long Range Capability


Sophia-Antipolis, France — Insight SiP has launched its ISP1807-LR module, a fully Bluetooth 5.0 Long Range compliant RF module in a miniature SIP package. It measures only 0.3 x 0.3 x 0.04 in. (8 x 8 x 1 mm) in size. This miniature BLE module is based on the nRF52840 chip from Nordic Semiconductor and repre- sents the latest in Bluetooth 5 Long Range module technology. It offers a Bluetooth 5 stack,


including long range, high through- put, advertising extensions and improved coexistence along with IPv6 connectivity and Mesh capabili- ties. With these characteristics, the ISP1807LR module is well-equipped to form the hub of Internet of Things (IoT) solutions. The ISP1807-LR module is a


good choice for IoT solutions that require complex applications, fast pro- cessing and/or best-in-class power con- sumption. These include ad vanced wearables, smart home and industrial sensors, advanced remote controls, gaming controllers, and beacons. The BLE part of the ISP1807-


LR integrates the nRF52840 chip from Nordic Semiconductor and employs the proven design of Insight SiP’s existing BLE product range. Like all of Insight’s products, it is a fully featured BLE device with inte- grated 32 MHz/32 kHz crystals, RF antenna and matching circuit and DC-DC convertor, thus having maxi- mum power saving efficiency. With an M4 floating point processor, the ISP1807LR Bluetooth


smart module can run fast and advanced calculations and support sophisticated applications with a large memory capacity (1 MB flash and 256 kB RAM). The embedded ARM Cryptocell-310 on-chip processor pro- vides security and cryptographic func- tions, saves CPU processing time and reduces energy consumption. A USB interface is also available. The Nordic Semiconductor chip’s BT5 Long Range feature is comple-


mented by Insight SiP’s proven “antenna in package” technology, which allows customers to get the most out of the long-range capability. Bluetooth long range offers up to


four times the range of a standard BLE solution, enabling a whole new set of use cases for BLE technology, in domains such as smart buildings, lighting, agriculture, infrastructure management, and many others. This feature-packed module


includes a USB driver, multi[ple I/Os and interfaces and a massive 1Mb of flash and 256K RAM. It is a multi- protocol capable device allowing the option to run Zigbee or Thread stacks


as an alternative to BLE. Contact: Insight SiP, GreenSide,


Bat. 7, Entree 2, 400 Avenue Roumanille, BP 309, F-06906


Sophia-Antipolis, France % +33-0-493-008-880 Web: www.insightsip.com


KOKI Releases Low-Voiding Solder Paste


Lake Elsinore, CA — KOKI Company Limited has introduced its S3X58- G803 for SMT applications, formulat-


cracking. As the usage of power tran- sistor components in SMT electronics is on the rise, the discharge of gener-


Page 85


Many kinds of components are


mounted onto PCBs with various sur- face finishes, including OSP, ImSn and ENIG. S3X58-G803 is designed to remove oxide film before the solder melts and quickly evacuate the flux from the molten solder, which reduces voiding. A heat-resistant activator sys-


tem in S3X58-G803 remains highly active throughout the soldering process for maximum wettability. The new solder paste exhibits heat durability, once it starts to melt,


X-ray image of components soldered with S3X58-G803


ed to reduce voiding in solder joints. Solder voids reduce the quality of the joints and can lead to fracturing or


 ULTRA COMPACT X-RAY SYSTEM


 • MEDICAL DEVICES


• BGA • QFN • LED Enabling Industry 4.0


CONNECTIVIT Y MATERIAL CONTROL TRACEABILIT Y ANALY TICS


    


  


Glenbrook Technologies, Inc. Rotator Positioner


ated gas/voids during reflow has become a critical factor for large-sized components.


reducing head-in-pillow defects. Contact: Koki Solder America, Inc., 18510 Pasadena Avenue,


Suite E, Lake Elsinore, CA 92530 % 951-245-8755 fax: 951-245-8655 E-mail: roberto@kokiamerica.com Web: www.kokiamerica.com


 


   


Glenbrook Technologies is Celebrating its 35th Year in Patented X-ray Technology 1 1


cogiscan.com


Custom


Configurations Available


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