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Page 104


hi-TeCh evenTS www.us- tech.com


NEPCON China 2019 to Launch New Micro-Assembly Pavilion


Shanghai, China — NEPCON China 2019 is scheduled to be held at the Shanghai World Expo Exhibition and Convention Center from April 24 to 26. An international event for the electronics manufacturing industry, the show will focus on a display of SMT equipment and technology, sol- dering and dispensing machines, smart factory and automation, test and measurement, and new electron- ic materials. The expo is expected to attract


more than 500 exhibitors and brands, displaying innovative solutions to more than 30,000 professional buyers from EMS, OEM and ODM factories of


consumer electronics. Current trends include 5G communication, smart homes, the Internet of Things (IoT), automotive electronics, and semicon- ductor packaging. NEPCON China 2019 will launch


a new pavilion and many conferences, including the Electronic Micro- Assembly and SiP Process Pav ilion, the Electronic Micro-Assem bly and SiP Process Conference, 2019 AWC Conference on Development and Testing Technologies for NEV Electro - mobility Systems and the Smart Manufacturing Dream Factory Con - ference. Held concurrently with the Smart Factory and Automation Tech -


SEMI Announces 2019 FLEXI Award Winners


Milpitas, CA — The 2019 FLEXI Awards recently recognized out- standing accomplishments in the flexible hybrid electronics (FHE) industry in 2018. Presented on February 20 at the 18th annual FLEX 2019 Conference and Exhib - ition in Monterey, California, the awards highlight leaders in the cate- gories of R&D achievement, product innovation and commercialization, technology and education leadership, and industry leadership. The “R&D Achievement Award”


was given to FlexEnable for develop- ing the world’s first, industrially proven, low-cost, flexible transistor technology, which allows displays to be built on plastic. This organic LCD


(OLCD) technology will soon be used in displays for a broad range of appli- cations. American Semiconductor was


given the “Product Innovation Award” for its FleX NFC, the indus- try’s first flexible IC to support NFC communication and new ways to con- nect to the Internet of Things (IoT). Mark Poliks, Empire Innova -


tion Professor of Engineering and director of the Center for Advanced Microelectronics Manufacturing at Binghamton University, was given the “Technology Champion & Lead - er ship in Education Award.” He won the award for advancing flexible and printed electronics and for his contri-


Continued on next page 2019 EDITOrIAL AND ISSUE Jan/Feb March April/May EDITORIAL


Assembly & Automation APEX PP ATX West PP


Test & Measurement


SMT & Production Nepcon China PP SMT/Hybrid/PKG PP


EDS PP June July August


Components & Distribution ATX East /MDM PP


Production & Packaging Semicon West/Intersolar PP


PCB & Assembly Nepcon South China PP


September Assembly & Automation SMTAI PP


APEX DesignCon


ATX/Electronics West/MDM APEC


Nepcon China SMT/Hybrid/PKG Wire Processing Tech BIOMEDevice EDS


ATX East /MDM SEMICON West/Intersolar Nepcon South China


Autotestcon PCB West


The Battery Show SMTAI IMAPS


October


SMT & Production Productronica PP


Nov/Dec


Test & Measurement Electronics West/MDM PP


PP= Product Preview


The Assembly Show MDM Minneapolis Productronica


BIOMEDevice San Jose


TrADEShOW CALENDAr SHOW


DATE


Jan. 29-31 Jan. 30-31 Feb. 5-7


March 19-21


April 24-26 May 7-9 May 8-9 May 15-16 May 15-18


June 11-13 July 9-11 Aug. 27-29


Sept. 10-12 Sept. 10-12 Sept. 10-12 Sept. 24-25 Oct. 1-3


Oct. 22-24 Oct. 23-24 Nov. 12-15 Dec. 4-5


LOCATION


San Diego, CA Santa Clara, CA Anaheim, CA


Anaheim, CA


Shanghai, China Nuremberg, Germany Milwaukee, WI Boston, MA Las Vegas, NV


New York, NY San Francisco, CA Shenzhen, China


National Harbor, MD Santa Clara, CA Novi, MI


Rosemont, IL Boston, MA


Rosemont, IL Minneapolis, MN Munich, Germany San Jose, CA


ATX/Electronics West/MDM Feb. 4-6/ 2020 Anaheim, CA


nology Expo, NEPCON China 2019 is designed to bring exhibitors and visi- tors a step closer to smart manufactur- ing in the electronics industry. By participating in NEPCON


China, well-known industrial forums and high-end conferences, business recommendation and matchmaking services, and new product guide tours, visitors can obtain new tech- nologies and gain insight into prod- uct trends. Pavilions include: “Surface Mount


Technology,” which covers the com- plete production chain, including mounting, welding, dispensing, spray - ing, test and measurement, and dis- plays leading brands from around the world; “Electronic Materials,” which provides a business platform for elec-


tronic material enterprises to commu- nicate with the R&D and design per- sonnel of users; “Test and Measure - ment,” which is a professional exhibi- tion and conference platform that is dedicated to displaying electronic product testing technology; and “Soldering and Dispensing,” which focuses on new equipment and tech- nology to provide buyers with more intelligent welding, dispensing and spraying systems. Contact: Reed Exhibitions


(Shanghai) Co., Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-2231-7181 E-mail: tim.wang@reedexpo.com.cn Web: www.nepconchina.com r


Trade Show Calendar MORE SHOWS: www.topline.tv/tradeshows.cfm


March 13-14, 2019, Texas Design-2-Part Show. * Gaylord Texan Convention Center, Grapevine, TX. Contact: D2P, 16 Waterbury Road, Prospect, CT 06712 % 800-225-4535 Web: www.d2p.com


March 17-21, 2019, APEC. * Anaheim Convention Center, Anaheim, CA. Contact: APEC 2018 c/o Smithbucklin, 2025 M Street N.W., Suite 800, Washington, D.C., 20036 % 202-973-8664 E-mail: apec@apec-conf.org Web: www.apec-conf.org


April 24-26, 2019, NEPCON China. * Shanghai World Expo Exhibition & Convention Center, Shanghai, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-2231-7181 E-mail: tim.wang@reedexpo.com.cn Web: www.nepconchina.com


May 7-9, 2019, SMTConnect. * NürnbergMesse, Nuremberg, Germany. Contact: Mesago Messe Frankfurt GmbH, Rotebühlstr. 83-85, 70178 Stuttgart, Germany % +49-711-61946-0 E-mail: info@mesago.com Web: www.smt.mesago.com


May 7-10, 2019, EDS.*The Mirage Las Vegas, Las Vegas, NV. Contact: EDS — Where the Electronics Industry Connects, 310 Maxwell Road, Suite 200, Alpharetta, GA 30009 % 312-648-1140 E-mail: eds@edsconnects.com Web: www.edsconnects.com


May 8-9, 2019, EWPTE. * Wisconsin Center, Milwaukee, WI. Contact: Expo Productions, Inc., 510 Hartbrook Drive, Hartland, WI 53029 % 262-367-5500 E-mail: cheryl@epishows.com Web: www.electricalwireshow.com


May 15-16, 2019, Design & Manufacturing New England. * Boston Convention & Exhibition Center, Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web: https://dm-newengland.com


May 15-16, 2019, BIOMEDevice.*Boston Convention & Exhibition Center, Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web: www.biomedevice.mddionline.com


May 22-23, 2019, Northern California Design-2-Part Show.*Santa Clara Convention Center, Santa Clara, CA. Contact: D2P, 16 Waterbury Road, Prospect, CT 06712 % 800-225-4535 Web: www.d2p.com


June 5-6, 2019, Upper Midwest Design-2-Part Show. * Minneapolis Convention Center, Minneapolis, MN. Contact: D2P, 16 Waterbury Road, Prospect, CT 06712 % 800-225-4535 Web: www.d2p.com


June 11-13, 2019, MD&M East. * Jacob K. Javits Convention Center, New York, NY. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200 Web: https://advancedmanufacturingnewyork.com


June 25-27, 2019, IMAPS Advanced SiP. * Monterey Marriott, Monterey, CA. Contact: IMAPS, P.O. Box 110127, Research Triangle Park, NC 27709 % 919-293-5000 Web: www.imaps.org/sip


July 9-11, 2019, SEMICON West. * Moscone Center, San Francisco, CA. Contact: SEMI, 673 South Milpitas Boulevard, Milpitas, CA 95035 % 408-943-6900 fax: 408-943-6986 Web: www.semiconwest.org


August 28-30, 2019, NEPCON South China. * Shenzhen Convention & Exhibition Center, Shenzhen, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070 % +86-21-2231-7000 fax: +86-21-2231-7181 E-mail: tim.wang@reedexpo.com.cn Web: www.nepconsouthchina.com


March, 2019


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