search.noResults

search.searching

dataCollection.invalidEmail
note.createNoteMessage

search.noResults

search.searching

orderForm.title

orderForm.productCode
orderForm.description
orderForm.quantity
orderForm.itemPrice
orderForm.price
orderForm.totalPrice
orderForm.deliveryDetails.billingAddress
orderForm.deliveryDetails.deliveryAddress
orderForm.noItems
Page 8


Award-winning solutions. Call: (618) 205 5007


bofaamericas.com


Fume Extraction and Filtration Systems


Mobile Extraction Arm Extraction


Cabinet Extraction Tip Extraction


www.us- tech.com


March, 2019


Hanwha Launches Modular Component Mounters at APEX


Continued from page 1


and marketing — North America, Hanwha. “The market’s response to the


HM series introduction at APEX 2019 exceeded expectations with multiple HM machine order commitments, so- lidifying Hanwha’s position as a glob- al maker of cutting-edge machinery for competitive PCB assembly opera- tions. Hanwha’s portfolio of entry-lev- el, mid-speed and high-speed assem- bly line solutions, combined with intel- ligent software for prediction and pre- vention puts us and our customers on an accelerated path to success, domes- tically and worldwide.” With the HM520 modular


mounter, actual productivity is, re- portedly, the highest among machines of the same class and is optimized for high-quality production. The system can be used to configure a flexible SMT line by applying a modular head and various modes of production. The machine can also help to realize un- manned, non-stop and zero-defect production, using the Smart Factory S/W solution. The high-performance HM520


EMAIL: sales@bofaamericas.com WEB: bofaamericas.com


BOFA AMERICAS, INC


CALL: (618) 205 5007 FAX: (866) 707 2632


offers a compact footprint, auto-cali- brating and maintenance-free feeders, and modular heads. Equipped with the high-speed (HS) head, the system offers 20 spindles per head, two gantries, and can reach speeds up to


80,000 CPH ±25 µm, with Cpk greater than or equal to 1.0, placing a compo- nent range of 008004 (0201 metric) up to approximately 0.24 in. (6 mm). When equipped with the multi- function (MF) head, the system offers


six spindles per head, two gantries, and can reach speeds of up to 60,000


CPH ±30 µm, with Cpk greater than or equal to 1.0, and placing components from 1005 (0402 metric) up to roughly


Hanwha’s HM520 modular component mounters.


2.2 in. (55 mm) in size. Hanwha provides synergistic


SMT assembly solutions, combined with world-class service and support. Solutions include state-of-the-art printing, placement, reflow, and board handling technologies. All systems in- clude installation, training, warranty, 24/7 technical phone support, next- business-day onsite support, next- business-day shipment of emergency spare parts, and free MMI software upgrades for the life of select gear. Contact: Hanwha Techwin


Automation Americas, Inc., 6000 Phyllis Drive, Cypress, CA 90630 % 714-373-4200 E-mail: jonny.n@hanwha.com Web: www.hanwhaprecisionmachinery.com r


Keener Eyesight for Autonomous Vehicles


For all your workbench needs. Continued from page 1


Heterodyne Detectors To achieve this, they imple-


Most Popular Hand Crank Adjust


mented a scheme of independent sig- nal-mixing pixels — called “hetero- dyne detectors” — that are usually very difficult to densely integrate in- to chips. The researchers drastically shrank the size of the heterodyne de- tectors so that many of them can fit into a chip. The trick was to create a compact, multipurpose component that can simultaneously down-mix input signals, synchronize the pixel array and produce strong output baseband signals. The researchers built a prototype,


which has a 32-pixel array integrated on a 0.002 in.2 (1.2 mm2) device. The pixels are approximately 4,300 times more sensitive than the pixels in to- day’s best, on-chip, sub-terahertz array sensors. With a little more develop- ment, the chip could potentially be used in autonomous cars and robots. “A big motivation for this work


is to have better ‘electric eyes’ for au- tonomous vehicles and drones,” says co-author Ruonan Han, an associate professor of electrical engineering and computer science, and director of the Terahertz Integrated Electronics Group in the MIT Microsystems Technology Laboratories (MTL).


Electric Adjust Packaging Benches 1proline.com PH: 800 739 9067


Decentralized design The key to the design is what


the researchers call “decentraliza- tion.” In this design, a heterodyne


pixel generates the frequency beat (the frequency difference between two incoming sub-terahertz signals) and the “local oscillation,” an electri- cal signal that changes the frequency of an input. This “down-mixing” process produces a signal in the megahertz range that can be easily interpreted by a baseband processor. The output signal can be used to


calculate the distance of objects, simi- lar to how LiDAR calculates the time it takes a laser to hit an object and re- bound. In addition, combining the out- put signals of an array of pixels, and steering the pixels in a certain direc- tion, can enable high-resolution im- ages of a scene. This allows for not on- ly the detection but also the recogni- tion of objects, which is critical in au- tonomous vehicles and robots. In order for the system to gauge


an object’s distance, the frequency of the local oscillation signal must be stable. To that end, the researchers incorporated into their chip a compo- nent called a phase-locked loop, that locks the sub-terahertz frequency of all 32 local oscillation signals to a stable, low-frequency reference. Be- cause the pixels are coupled, their lo- cal oscillation signals all share iden- tical, high-stability phase and fre- quency. This ensures that meaningful


information can be extracted from the output baseband signals. This entire architecture minimizes signal loss and maximizes control. Web: www.mit.edu r


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108