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He continued, “The SE2601T, which integrates features that until now have been discrete on the device motherboard or inside of a module solution, occupies less board space and offers significant advantages for designers of today’s cool, feature-rich mobile devices”.
The 2601T leverages the performance and functional integration strengths of silicon- based RF solutions. It is claimed to improve the connectivity range of the Wi-Fi solution by placing a high-performance LNA between the antenna and the RF receiver that is part of chipsets from vendors such as CSR, Marvell, Broadcom and Atheros.
Often the LNA function is omitted in embedded applications such as smartphones due to physical space constraints on the Wi- Fi solution, thus degrading connectivity performance. This LNA is claimed to significantly increase the sensitivity of the Wi- Fi receiving system – critical in embedded applications where physically small antennas are limited in their contribution to signal quality.
The RF switch supports antenna sharing between Bluetooth and 802.11bgn functions and is typically a discrete device requiring additional passives. The 2601T incorporates this function but has a much smaller footprint (2mm x 2mm x 0.6mm) than conventional solutions.
It also integrates the required DC blocking capacitors through the use of a silicon-based IC process. The GaAs-based competition for the 2601T requires external capacitors consuming additional circuit board space and causing incremental increase in bill of materials cost for the Wi-Fi solution.
Utilizing a 2x2mm QFN package, the 2601T is part of a family of SiGe’s silicon-based RF switch/LNA products, complementing the recently released SE2600S chip-scale package (CSP) FEIC. While the 2600S is designed for module vendors, the 2601T is best suited to direct placement on the embedded device’s motherboard.
The SE2601Tcomes is a compact lead and halogen free ROHS-compliant QFN package and is priced at $0.35 in quantities of 10,000 units. It is sampling now and is offered with product and evaluation board datasheets and extensive application notes surroundingthe use and implementation of the device.
Sharp announce entry to U.S. LED Lighting Market
The company will initially introduce PAR38 lamps in May and PA39 modules in the summer to businesses, followed by A19 lamps to businesses and consumers in the fall.
Sharp has made its official debut in the U.S. LED lighting market at Lightfair International 2010. With a 40-year history in the mass production of LED devices, Sharp has been at the forefront of the LED technology industry since its inception and is a market leader of LED lighting in Japan.
“As a leading electronics company, we understand how to manufacture, market and service electronics products and this foundation enables us to provide LED lighting innovations for eco-conscious customers,” said Christine Lewis, Associate VP of Sharp Electronics’ LED Lighting division. “We will also look to Sharp’s strength in solar technology to offer future LED lighting solutions for both businesses and consumers.”
Sharp’s initial U.S. launch will be commercial/ June
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