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MediaTek awards Skyworks for Compact Handsets


SKYWORKS has announced design wins from MediaTek in support of dual and quad band platforms targeting low-cost handsets.


MediaTek, a fabless semiconductor company for wireless communications and digital multimedia products provides chipsets to the Chinese mobile phone industry.


The products have their own baseband processor, radio, multimedia and connectivity products and the necessary software. MediaTek then leverages front-end solutions to offer a turnkey approach to manufacturers who supply handsets to consumers around the world.


Skyworks’ front-end solutions for MediaTek’s MT6253 platform and other customers are claimed to have the best power-added efficiency performance over a broad power range, increasing talk and extended standby times for handsets and data card modules.


Skyworks’ compact and integrated total transmit products consist of a power amplifier (PA), switch module, and automatic power controller and are claimed to reduce bill-of-material costs and overall board space.


“MT6253 is our first 2.5G system-on-chip,


integrating all essential electronic components, including DBB, ABB, power management unit and RF transceiver,” said JiChang Hsu, Executive VP at MediaTek. “It is rapidly ramping and is expected to be one of the main, high-volume runners in the coming years.


Together with Skyworks’ front-end modules, the MT6253 platform further reduces the


material count and size of a complete mobile phone.” “Skyworks is delighted to be partnering with MediaTek as they meet the growing demand for mobile handset platforms in emerging markets,” said Liam K. Griffin, Senior VP of Sales and Marketing at Skyworks. “Our proven, low-cost and compact solutions are ideally suited for this high growth, feature-rich handset segment where size, value and performance are key drivers.”


All four front-end modules (FEMs) are compact and are suited to transmission applications. They all support Class 12 general packet radio service (GPRS) multi- slot operation.


Tecnalia to use SiC and GaN in energy usage project


The 5 year project will enable a more rational use of electrical energy in all industrial sectors, say MBN Comunicación.


Tecnalia Technological Corporation is taking part in “Consolider Rue”, one of the most important research projects on power electronics within the Spanish state.


The Semiconductor Devices project involves a wide band of energy gaps for efficient energy use, with particular emphasis on renewable energies, the electric vehicle and very high frequency communications.


It is part of the “Consolider” program, a strategic policy of the Spanish Government aimed at achieving excellence in research, increasing cooperation amongst researchers and creating large groups of research.


Tecnalia is the only technological centre in the consortium and is able to provide a very clear vision of the interest of private enterprise in working with power electronics-related themes. The fundamental


contribution of its Energy Unit involves applications, responding to the keen linterest in new topologies of converters for the evacuation of high-voltage, direct current energy (HVDC), for offshore wind energy.


The budget for the project is €4.56 million and is being funded by the Ministry of Science and Innovation and by the Consejo Superior de Investigaciones Científicas (CSIC). The project is coordinated by the CNM and the rest of the participants are teams from six Spanish universities ; Oviedo, Zaragoza, Madrid Polytechnic, the Polytechnic of Catalonia and the Rovira i Virgili University, apart from the Energy Unit at Tecnalia.


The principal aim is to develop the first industrial generation of wide band gap semiconductor devices that enable both important improvements in current power converters and the development of new topologies based on silicon carbide (SiC) and gallium nitride (GaN) technologies.


June 2010 www.compoundsemiconductor.net 11


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