news Northrop InP HEMT Raises the Frequency Bar


Northrop Grumman Corporation reports its Terahertz Monolithic Integrated Circuit (TMIC) operating at 0.67 terahertz (THz) more than doubles the frequency of the fastest reported integrated circuit.


The latest innovation was developed under a contract with the Defense Advanced Research Projects Agency’s (DARPA) Terahertz Electronics program. The Indium Phosphide High Electron Mobility Transistor (InP HEMT) is claimed to more than double the frequency of the fastest reported integrated circuit.


A transistor amplifier magnifies input signals to yield a significantly larger output signal. In 2007, Northrop Grumman set a world record for transistor speed to provide much higher frequency and bandwidth capabilities for military communications, radar and intelligence applications.


This InP HEMT had a maximum frequency of operation of more than 1,000 gigahertz, or greater than one terahertz.


The latest development was described at the Institute of Electrical and Electronics Engineers’ (IEEE) International Microwave Symposium by William Deal, THz


Electronics Program Manager for Northrop Grumman’s ‘Aerospace Systems’ sector. He told fellow scientists the TMIC amplifier is the first of its kind operating at 670 GHz (top).


He continued, “A variety of applications exist at these frequencies. These devices could


double the bandwidth, or information carrying capacity, for future military communications networks. TMIC amplifiers will enable more sensitive radar and produce sensors with highly improved resolution.”


SEM micrograph showing ~ 30nm Indium Phosphide T-gate (left).


The goal of DARPA’s Terahertz Electronics program is to develop the critical device and integration technologies necessary to realize compact, high- performance, electronic circuits that operate at center frequencies exceeding 1.0 THz.


The program focuses on two areas – terahertz high-power amplifier modules, and terahertz transistor electronics.


“The success of the THz Electronics program will lead to revolutionary applications such as THz imaging systems, sub-mm-wave ultra-wideband ultra-high- capacity communication links, and sub-mm- wave single-chip widely-tunable synthesizers for explosive detection spectroscopy,” according to John Albrecht, THz Electronics Program Manager for DARPA.


Skyworks Retires $20.4 million of Principal Convertible Debt


As the balance sheet improves, the firm announced that 2.1 million shares will not need to be diluted.


Skyworks, a provider of analog and mixed signal semiconductors enabling a broad range of end markets, has announced that the Company retired an additional $20.4 million of convertible notes with an original maturity date of March 2012.


With the early retirement of this debt, Skyworks eliminated potential future dilution of 2.1 million shares and, at a higher level, continues to enhance its overall capital structure.


At the end of the Company’s most recently reported quarter, Skyworks maintained $412 million in cash and cash equivalents with a principal value of $47 million in long-term convertible debt.


14 www.compoundsemiconductor.net June 2010


At the end of the second fiscal quarter of 2008, the company held $228 million in cash and cash equivalents and $200 million in long-term debt.


“Skyworks has generated $323 million in cash flow from operations over the past six quarters, enabling us to efficiently deleverage our balance sheet,” said Donald W. Palette, CFO of Skyworks.


“This financial strategy has supported increasing business throughout the economic downturn as customers, suppliers and partners appreciate the strength of our balance sheet in today’s market environment.


As a result, we intend to outperform our addressed markets and further improve our capital structure going forward.”


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