July, 2016
San Jose, CA — The latest packaging solutions will be the topic of an in- depth session at the SEMICON West 2016 Advanced Packaging Forum — and on display on the exhibition floor. Rapidly changing technologies and accelerated product life cycles are driving the need for new assembly and packaging solutions suited for next-generation products, such as Internet of Things (IoT) devices and wearable electronics. To meet these packaging needs, semiconductor tech- nologies with smaller form factors, lower power consumption and flexible designs are increasingly in demand. Six complimentary packaging
sessions are offered at the Advanced Packaging Forum at SEMICON West’s TechXPOT North stage. Pre- registration is required. The sessions will explore what’s ahead in the world of packaging and assembly. The three-day forum will cover the chal- lenges posed by new and emerging devices and offer solutions capable of handling them. Technical sessions include: SiP Next 1: Processor — Memory/Analog Integration; SiP Next 2:
SMTA Program Finalized
Continued from previous page Mr. Kuhl will share current
technologies, technology enablers of the future and speak on the memory consumption rate of today and what is anticipated for the future. All visitors to SMTA Inter -
national are invited to attend a ses- sion of women presenters on Monday afternoon. This will be fol- lowed by a panel discussion at 4:00 p.m. on the technical achievements of women, mentoring, and STEM initiatives. The afternoon concludes with the expo’s annual Women’s Leadership Connection Reception. Flex, a provider of supply chain
solutions and manufacturing servic- es, has sponsored the “SMART Zone,” a new feature area combining the use of manufacturing techniques, embed- ded technology and sensor capabili- ties. The zone will have demonstra- tions of practical uses for sensors and wearables plus the materials re - quired to make them work in a real- world environment. Finally, on Tuesday and Wed -
nesday of the show, Tech Tours are returning to the exhibit hall show floor. This is an opportunity for attendees to participate in technolo- gy-focused tours that showcase the latest equipment and solutions in a small group setting with no sales pressure. The topical areas will be place-
ment or printing and dispensing. Exhibiting partners will provide a demo of their product, a short tech- nology-based presentation or specif- ic application support. Tech Tours are complimentary to all attendees and pre-registration is not required. Contact: SMTA, 6600 City
West Parkway, Suite 300, Eden Prairie, MN 55344 % 952-920-7682 fax: 952-926-1819 Web:
www.smta.org
www.us-
tech.com
Enabling Applications for a Smarter World; Packaging Developments for Flexible, Hybrid Electronics; Pack ag - ing Power: Enabling a Variety of Applications and Efficiency; Packag - ing Photonics for Speed & Bandwidth. The technical sessions are given
by speakers from Cisco, Mentor Graphics, Texas Instruments, and others. Attendees will learn about the latest in electronic packaging, thermal management, additive man- ufacturing, simulation, and reliabili- ty assessment; system optimization and differentiation through hetero- geneous integration and SiP; sensor technologies for monitoring and ana- lyzing complex data streams; and other advanced developments.
This year’s SEMICON West
exposition also showcases packaging solutions on the show floor. Atten - dees can view more than 60 new products from some 200 exhibitors. The industry is seeing dramatic changes and SEMICON West 2016 has expanded its technical program- ming by nearly 50 percent to help attendees get a clear view of the road ahead. To learn more about SEMICON
West 2016’s eight new forums (Extended Supply Chain, Advanced Manufacturing, Advanced Packag - ing, Test, Silicon Innovation, Flexible Hybrid Electronics, and World of IoT), visit the SEMICON website (
www.semiconwest.org).
Page 93 Advanced Packaging Forum at SEMICON West 2016 SEMI® connects more than 2,000
member companies and more than a quarter-million professionals world- wide to advance the science and busi- ness of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable elec- tronic products. Since 1970, SEMI has built connections that have helped its members grow more profitably, create new markets, and address common industry challenges together. Contact: SEMI, 3081 Zanker
Road, San Jose, CA 95134 % 408-943-6900 fax: 408-428-9600 Web:
www.semi.org
IoT & Smart Things — SiP Integration; Sensing the Future:
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