July, 2016
www.us-
tech.com
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LPKF: Advanced Laser Solutions for Via Forming and Direct Laser Structuring
Tualatin, OR — LPKF Laser & Electronics, a manufacturer of laser systems for electronics manufacturing, has introduced new laser solu- tions for electronic interconnects, including vias and laser-structured, ultra-fine circuits. One of the technologies developed by
LPKF is efficient via forming in large glass substrates (TGV): a process of creating through-holes and blind vias, with defined diameters as small as 15µ, using single-pulse glass modification by laser beam in combina- tion with a subsequent standard wet-etching process. Glass substrates with a thickness of 50 to 500µ can be processed with this method. Cleanroom compatibility and stress- free processing make this laser-based process useful for thin glass inter- posers and also for solid glass cores for FCBGA substrates — eliminating chips, burrs, micro-cracks or voids. The company has created its
Vitrion laser system specifically for these applications. The system is designed for high-volume mass pro- duction and is capable of forming more than 5,000 homogeneous vias per second. Another technology developed by
the company is its Laser Direct Structuring (LDS technology) for
PEM Intros Reusable Brass Thread Inserts
MEMS, a method of creating ultra-fine circuits directly on 3D parts used for chip packaging. The highly flexible and stress- free laser direct structuring process is designed for advanced electronic packag- ing where space is a premium and high
layout flexibility is a benefit. Contact: LPKF Laser & Electronics,
12555 SW Leveton Drive, Tualatin, OR 97062 % 503-454-4200 fax: 503-682-7151 Web:
www.lpkfusa.com
Laser-formed through-glass vias (TGV).
See at SEMICON West, Booth 6257
Danboro, PA — PennEngineering®, a developer and manufacturer of preci- sion fasteners, components and sys- tems, has designed its type MSIB™ microPEM® brass inserts to provide reusable metal threads that attach plastics securely in compact electron- ic assemblies. Their symmetrical shape accommodates either straight or tapered holes and eliminates any need for orientation of the inserts during installation. The inserts install permanently into ABS, poly-
An unveiling of innovative X-Ray inspection is coming
All Scienscope X-Ray inspection systems offer the best performance to price ratio in the industry
Each machine is a complete package solution with no line item costs Advanced X-Ray tube technology High resolution flat panel detectors Camera tilt for oblique angle inspection up to 65° Rotation of test object up to 360°
Advanced automated and manual s/w tools for BGA, POP, CSP, and much more
Most user friendly GUI with simple point and click instructions, step-and-repeat, macros, etc
Reporting and traceability features Flexibility
Brass thread inserts for substrate attachment.
carbonate and other plastic sub- strates by being pressed into the host material using ultrasonic equipment or thermal press. Upon installation, they will not loosen or fall out. The inserts have threads as
small as M1, can be specified in a range of lengths and will mount in plastics as thin as 0.7 mm (0.028 in.). Mating hardware completes final component attachment. Type MSIB inserts join a growing family of microPEM fasteners engineered for
precision attach ment requirements Contact: PennEngineering,
5190 Old Easton Road, Danboro, PA 18916 % 215-766-8853 E-mail:
info@pemnet.com Web:
www.pemnet.com
Ability and willingness to offer customize equipment built for your application
To see the latest innovation “behind the curtain”, or our popular X-Scope series (1800, 2000, 3000, and 6000), please make an appointment to see us at APEX, or send us your product and schedule a “live” online demo without leaving your factory.
SCIENSCOPE We Sell Solutions
800.216.1800
www.scienscope.com
8:14 AM
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