July, 2016
www.us-
tech.com
Page 71 YXLON Improves FeinFocus Product Line
Hamburg, Germany — YXLON, a manu- facturer of radioscopic and CT inspection systems and sold in the U.S. by COMET Technologies, has improved its FeinFocus product line with “Micro3Dslices.” This laminography solution moves the compa- ny’s inspection systems into the semicon- ductor area. The systems’ new virtual rotation axis and precision of the manipu- lator assembly allow for simple operation and higher inspection throughput. This solution is much more accurate
than previous versions, due, in part, to the quality of design and engineering in the new manipulator assembly, allowing smal - ler and less dense features to be imaged than was previously possible. The technol- ogy produces vastly superior laminography results, when compared with other systems that revolve the detector or use inferi- or manipulators. The inspection of a complex
assembly or component with Micro - 3D slices, including the automatic analysis of the slice-by-slice images, now takes less than 40 seconds per part. With its virtual rotation axis, the region of interest can be chosen at any point on the large inspection area and Micro3Dslices can get started
HexAlign Microrobot from PI
Continued from previous page
sive stacks of stages, the positioning bandwidth can be an order of magni- tude faster. So, a typical approach for align-
ing input and output devices to a double-sided waveguide is to: a) Step the input device; b) Perform the FSA fast-scan on the output device; c) Iterate until a threshold amount of coupling is achieved. At that point, FSA can be used to fully optimize the coupling.
A Deep Toolkit The H-206, and its C-887 con-
troller, offers fast networkable inter- facing, 0.1 µm resolution and micron- scale step/settle responsiveness on the order of 25 ms. But one of its biggest contributors to the photonics industry is its built-in scan/align algorithms, flexibility and speed. Specialized scan/align algo-
rithms built into the C-887 controller include array-alignment routines for multichannel waveguide devices, and fast I/O optimization routines for sin- gle-sided devices. For applications benefiting from custom algorithm integration, a rich macro-language and non-volatile macro-storage are standard features. The industry is expanding with
no shortage of production applica- tions needing high throughput and high uptime. Fortunately, a well- stuffed toolbox with industrial-class solutions to meet a new generation of device and applications challenges is now available. Contact: PI (Physik
Instrumente) L.P., 16 Albert Street, Auburn, MA 01501 % 508-832-3456 fax: 508-832-0506 E-mail:
stefanv@pi-usa.us Web:
www.pi-usa.us r
See at SEMICON West, Booth 1129
immediately, providing constant inspec- tion results of high precision and quality. Semiconductor and wafer inspections also benefit from the improved mapping tech- nology, and precise defect markings sup- port the easy sorting of defective parts. The technology also offers a leap for-
ward for all types of 2D imaging and the accuracy and repeatability for other inspection routines, as well as analyses in the field of electronics applications, including QFN inspection. Contact: COMET Technologies USA,
Inc., 2370 Bering Drive, San Jose, CA 95131 % 408-325-8770 fax: 408-325-8773 Web:
www.yxlon.com
Y.Cheetah X-ray system with manipulation assembly.
See at SEMICON West, Booth 5752
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