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tech.com
July, 2016
SEMulator3D 6.0 and Add-on Package
Released by Coventor
Cary, NC — Coventor®, a supplier of automated software for semiconduc- tor devices and MEMS, has released its SEMulator3D 6.0, the latest ver- sion of its virtual semiconduc- tor fabrication platform. The new version increases the accuracy of the process simu- lation, geometry and model- ing of advanced semiconduc- tor processes with new fea- tures, and usability enhance- ments. Along with SEMu - lator3D 6.0, the company is releasing an all-new SEMu - lator3D Elec trical Analysis add-on component that allows seamless
resistance and
capacitance extraction direct- ly from SEMulator3D process- predictive 3D models. In semiconductor device
SEMulator3D 6.0 is the latest
version of the virtual semiconductor design platform.
fabrication, the various processing steps have grown increasingly complex as smaller feature sizes and nodes are developed. With shrinking process technologies, the parasitic effects of devices and interconnects have a sig- nificant impact on circuit performance. SEMulator3D Electric al Analysis builds in new features and solvers so that users can better understand resistance and capacitance impacts of design and process variation. SEMulator3D 6.0 enables accu-
rate modeling and performance pre- diction for next-generation processes including FinFETs, 3D NAND Flash, BEOL, Nanowires, 3DIC, FDSOI, and DRAM. The new version includes some major improvements. A new analysis editor environment now sepa- rates analysis steps, such as metrolo- gy, structure search and parasitic extraction from the process sequence. This allows improved usability, faster
dom systematic and arrayed defects, reflecting the various sources of pos- sible manufacturing issues in the fab. This diagnostic improvement enables a known defect to be traced back to the originating process step or tool that may have created it. The program now allows users
to export meshes to additional file formats, including dopant concentra- tions, for use in third-party FEA/ BEA software. This provides users the benefit of having the accuracy of the SEMulator3D process simulation and geometry along with the ability to model additional complex physical
phenomena using other tools. Contact: Coventor, Inc., 1000
Centregreen Way, Suite 200, Cary, NC 27513 % 919-854-7500 E-mail:
sales@coventor.com Web:
www.coventor.com
See at SEMICON West, Booth 2622
ClassOne Provides Savings with Solstice Plating Systems
THIS IS RELIABILITY
CHO-TOUCH EMI SHIELDED TOUCHSCREEN LCD DISPLAYS
Integrated EMI Shielding with LCD display for fast design cycle
Projected capacitive touchscreen for simple interface Complete assembly for reduced design complexity
CHO-TOUCH LCD Displays have been designed to reduce time to market and simplify the customer design experience. Parker Chomerics integrates touchscreens, EMI shielding, optical bonding and high performance LCDs into a complete assembly that is ready to go out of the box.
www.chomerics.com/optical chomericsoptical@parker.com
See at SEMICON West, Booth 6557
Kalispell, MT —ClassOne Technol ogy, a manufacturer of wet processing equipment, offers its Solstice® electro- plating systems, which reportedly pro- vide significant savings in the plating of gold in £200 mm (£7.87 in.) applica- tions. The savings come from the elim- ination of gold waste, faster and sim- pler processing, and Solstice tech- niques that reduce gold usage. An issue particularly in emerg-
ing markets such as lasers, LEDs, RF, and MEMS, which may require gold layers anywhere from 3 to 35µ thick, using the Solstice system can econo- mize the electroplating process. Pre - viously used CVD and PCV methods deposit gold not only on the wafer, but also on the entire chamber interior and the over-sprayed gold is difficult to remove as well as to reclaim — which leads to considerable gold loss. The Solstice system deposits gold on the wafer only, which makes cleaning and gold reclamation unnecessary. Another benefit of the Solstice
system is its speed. Plating at rates of 150 to 300 nm/min, it is roughly ten times faster than CVD and PVD methods. In addition, the system starts processing immediately and does not require an hour or more for pump-down like vacuum-based tools.
The Solstice’s eight-chamber
design enables it to readily replace a solid gold layer with a multi-metal stack —substantially reducing overall gold usage. A feature that may previ- ously have required a 5 µm layer of solid gold can be replaced with a “sandwich” of 0.25 µm Au, 1 µm Ni, 2.5 µm Cu, another 1 µm Ni, and topped with a final 0.25 µm of Au. This may achieve equivalent function- ality while reducing gold usage by a factor of ten. The system’s multi- chamber design enables it to deposit all five layers in a single cycle; no additional process steps or time are required to gain cost savings. The Solstice S8 contains eight
modular chamber positions that can be used for plating a wide range of metals, as well as performing addi- tional processes. Solstice tools are available in three different models for production and development and serve many emerging markets that use 200
mm (7.87 in.) and smaller wafers. Contact: ClassOne Technology,
109 Cooperative Way, Kalispell, MT 59901 % 678-772-9086 E-mail:
pr@classone.com Web:
www.classone.com
See at SEMICON West, Booth 1821
analysis runtimes and simpler collab- orative deployment. Defect insertion and placement has been enhanced to allow for ran-
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