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tech.com
July, 2016
MVP Offers AOI with Diverse Inspection Toolbox
Carlsbad, CA — Machine Vision Products (MVP) offers a diverse selection of inspection tools for microelectronics and packaging in its MVP 850 platform. The machine has been designed for high-accuracy, high-speed inspection and can be configured to provide 1 µm pixel res- olution. Applications of the platform include lead frame inspection for die placement, epoxy and wire bond inspection, and new surface inspec- tion capabilities. The company’s microelectronics
AOI platforms can be equipped for lot solutions, such as magazine lifters/ indexers, Jedec trays, waffle packs, and Auer boats. The in-line systems allow both single- and dual-lane pro- cessing, strip handling and in-line wafer handling. The company also delivers custom handling solutions for specialized inspection applications. MVP’s AOI systems are useful
for a range of applications, such as: lead frame inspection including die placement metrology, wire bond,
epoxy spread and bridging, and lead frame integrity; BGA inspection including 2D and 3D high-resolution imaging, ball diameter, shape, offsets,
of its AOI technologies to provide advanced traceability options for its customers. The company has devel- oped its AutoNetworker, a central- ized database with the flexibility to be configured for a host of data min- ing options. For SMT and Microelectronics,
MVP 850 AOI platform.
damage, coplanarity and height meas- urements; metrology inspection inclu - ding die alignment metrology on the substrate, edge, FM and surface inspection, as well as flux and paste inspection; and dice wafer inspection including die metrology and inspec- tion of die surface and edge chips. MVP is also a provider of soft- ware solutions that extend the power
both measurement and pass/fail data can be stored for every product, from every lot or work order and scalable dependent on the customer’s require- ments. Data can be retained based on a customer’s own requirements from short term to endless data col- lection. The software has the ability to quickly create reports for quality managers, operation managers and process engineers through a web- based interface. A significant new development is
the software’s new scalable image archiving capability, which can save every defect image detected by multi- ple AOI machines. For processes where quality is especially critical, the ability to provide visual traceability as
well as data traceability is essential. The company has also launched
the new 2020 DWMS AOI solution for lead frame inspection. The MVP 2020 DWMS can be configured for cleanrooms up to Class 100. The 2020 includes MVP’s integrated loader and unloaders and gripper based transport to and from the inspection bay. For Class 100 config- uration, stainless steel skins and laminar fan/filter units are optional. The 2020 DWMS is a modular
solution with options for additional ink marking, lead frame puncher and wire ripper capabilities within its review/defect handling stage. Depending on lead frame density, the 2020 DWMS is capable of produc-
ing UPH of better than 150,000. Contact: Machine Vision
Products, Inc., 5940 Darwin Court, Carlsbad, CA 92008 % 760-438-1138 E-mail:
sales@visionpro.com Web:
www.visionpro.com
See at SEMICON West, Booth 6471
Manufactured in the U.S.A. since 1966
www.westbond.com
1551 S. Harris Court Anaheim, CA 92806 See at SEMICON West, Booth 5872 Tel 714·978·1551 See at SEMICON West, Booth 5960
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