July, 2016
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tech.com
Page 27 Wacker Presents New Gap Filler Material
Adrian, MI — Wacker, the Munich-based chemical company, has introduced a new heat-conducting sil- icone-based gap filler material for the electronics in- dustry. Available under the trade name SEMI- COSIL® 961 TC, the silicone rubber is useful as an interface material for thermally-connecting electron- ic circuits, ensuring effective heat management. SEMICOSIL® 961 TC is a highly-filled, two-
part silicone rubber that cures at room temperature by way of a platinum-catalyzed addition reaction that forms a soft silicone elastomer with a tacky sur- face. The cured rubber achieves a thermal conductiv- ity of 2 W/m°K and, at the same time, is electrically insulating. Before it cures, the gap filler is a non-sag mate-
rial. However, its viscosity decreases with increased shearing, for example during mixing and metering. Its shear-thinning property is adjusted so that the silicone rubber can easily be fed by ma- chine and applied as a bead. Proces- sors can achieve a high metering rate and very high dosing accuracy. The gap filler has been designed
to ensure excellent heat transfer from the electrical circuit to a heat sink. In practice, the material is first applied to the heat sink. The circuit board is then pressed on or fitted by means of a vac- uum process. During compression, a continuous film forms that conforms snugly to the surfaces of the two join- ing parts. In this way, surface irregu- larities and tolerances can be evened out. The film maximizes the contact area and promotes heat transfer. The film cures to form a silicone layer between the joining parts. Due to
Indium’s Recycling Program Enriches ROI
Clinton, NY — Indium Corporation’s indium metal and indium alloy re- claim and recycle program is earning customers enhanced returns on used materials. Indium is used extensive-
Heat-conducting gap filler material.
its soft consistency, it ensures a reliable, tight fit even if there are frequent temperature changes and vibrations. In addition, the new silicone gap filler can be used over a wide temperature range. Its prop-
erties remain unchanged between –45 and +180°C (–49 and +356°F). Despite its high filler loading, it has a compar-
atively minor abrasive effect on the mixing and me- tering equipment used to apply it. This means that there is less abrasive damage to feed pumps than is usually the case with highly-filled silicone rubber. This leads to longer service lives of mixing and me- tering equipment and cost advantages in processing. The new gap filler contains hardly any
volatile components. In terms of fire-safety proper- ties, tests show that the silicone product meets the specifications for classification V-0 as per UL 94. The material is available in both Euro cartridges
and 30-kilogram pails. Contact: Wacker Chemical Corp., 3301 Sutton
Road, Adrian, MI 49221 %888-922-5374 fax: 517- 264-8246 Web:
www.wacker.com
Indium is able to reclaim and recycle a variety of metals.
ly in thermal management, low tem- perature soldering and sealing appli- cations. In many instances, the indi- um is not fully consumed and can be reclaimed from the process. This in- dium-containing material can be re- turned to Indium Corporation for re- cycling or financial credit. Not only is recycling an impor-
tant process, and a responsible corpo- rate policy, it also provides the indium and indium alloy consumer a financial benefit. When a consumer diverts used indium from the waste stream back to Indium Corporation, they are turning scrap into a financial gain. The company also offers reclaim
and recycle programs for germanium, indium tin oxide (ITO), indium galli-
um zinc oxide (IGZO), and bar solder. Contact: Indium Corp., 34
Robinson Road, Clinton, NY 13323 % 315-381-7524 E-mail: abrown@in-
dium.com Web:
www.indium.com
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