This page contains a Flash digital edition of a book.
February, 2013


www.us-tech.com


Page 99 Pillarhouse Intros New Soldering Combo


Elk Grove Village, IL — Pillarhouse is releasing its new Jade-Prodex selective soldering system, which stems from the company’s hand-load Jade platform. The Prodex incorpo- rates DC servo drives and has twin independent solder pots that can be configured with Multi-dip, AP1 and Jet Wave nozzles. The system pro- vides auto pot changing, along with the highly acclaimed Handex board load system. Because of the ever- increasing pre-heat requirements for lead-free alloys, a new underside pre- heater is available as an option, using the company’s patented slide- in/slide-out pre-heater module. The company is also releasing


its new high speed Fusion platform, which incorporates high-speed trans- fer with maximum flexibility and reduced line length at a lower cost compared to current market offer- ings. The standard cell can be config- ured in 24 x 24 (fluxer/pre-heat/sol- der) for the CM, or, the cell can be


Digicom Enhances Product and Process Control


Oakland, CA —EMS provider Digicom Electronics, Inc. is introducing its Diamond Track Process, a multifac- eted approach to quality and produc- tivity. The processes include advanced cleaning, selective soldering, purchas- ing and inventory management, pro - cess control, inspection and test, and


configured with fluxer/pre-heat and up to 3 solder modules with 8 heater options for high speed applications. The solder cells can be config-


ured with any of the company’s solder technologies; custom dip, multi dip, jet wave and AP1, down to 1.5mm and the new easy auto pot changer for fast non contact changeovers. The system is highly flexible and is very competi-


tively priced. Contact: Pillarhouse USA, Inc.,


635 Touhy Ave., Elk Grove Village, IL 60007 % 847-593-9080 fax: 847-593-9084 Web: www.pillarhouseusa.com


Fusion high-speed flexible line. See at IPC/APEX Booth #3141.


We’ve forged the path …


for your product’s success.


Diamond track cleaning process.


process validation. These activities enhance productivity, product control, quality, and integrity of the products that Digicom builds. New to the Diamond Track


Process is selective soldering equip- ment, in an inert, Nitrogen environ- ment, that improves throughput while achieving solder joint quality at “preferred target” IPC-610 stan- dards. To ensure the company’s high quality objectives and goals, it added the most advanced, laser equipped optical inspection machine, with multiple side-angle camera vision that captures even minor defects and compiles statistics that are extracted and monitored. The last mile, critical to high reliability PCBAs, was the design and implementation of a wash process that enables Digicom to achieve levels of cleanliness far above best levels of acceptability,


based on IPC-TM-650 standards. Contact: Digicom Electronics,


Inc., 7799 Pardee Lane, Oakland, CA 94621 % 510-639-7003 E-Mail: info@digicom.org Web: www.digicom.org


See at IPC/APEX Booth #1601. www.jtag.com See us at IPC/APEX Booth 910 4:01:55 PM


Boundary-scan defined


Algorithm innovations for test and ISP


Integrated production test solutions


Testing of advanced digital networks


Technology fuels our passion Boundary-scan at its best.


Technology fuels our passion for innovation. Turn to us for advanced solutions in test and programming.


Automated, rapid test development


Visualization to “see” boundary-scan


Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44  |  Page 45  |  Page 46  |  Page 47  |  Page 48  |  Page 49  |  Page 50  |  Page 51  |  Page 52  |  Page 53  |  Page 54  |  Page 55  |  Page 56  |  Page 57  |  Page 58  |  Page 59  |  Page 60  |  Page 61  |  Page 62  |  Page 63  |  Page 64  |  Page 65  |  Page 66  |  Page 67  |  Page 68  |  Page 69  |  Page 70  |  Page 71  |  Page 72  |  Page 73  |  Page 74  |  Page 75  |  Page 76  |  Page 77  |  Page 78  |  Page 79  |  Page 80  |  Page 81  |  Page 82  |  Page 83  |  Page 84  |  Page 85  |  Page 86  |  Page 87  |  Page 88  |  Page 89  |  Page 90  |  Page 91  |  Page 92  |  Page 93  |  Page 94  |  Page 95  |  Page 96  |  Page 97  |  Page 98  |  Page 99  |  Page 100  |  Page 101  |  Page 102  |  Page 103  |  Page 104  |  Page 105  |  Page 106  |  Page 107  |  Page 108  |  Page 109  |  Page 110  |  Page 111  |  Page 112  |  Page 113  |  Page 114  |  Page 115  |  Page 116  |  Page 117  |  Page 118  |  Page 119  |  Page 120  |  Page 121  |  Page 122  |  Page 123  |  Page 124  |  Page 125  |  Page 126  |  Page 127  |  Page 128  |  Page 129  |  Page 130  |  Page 131  |  Page 132  |  Page 133  |  Page 134  |  Page 135  |  Page 136