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February, 2013 Nihon Superior: Special Solder Formulations
Osaka, Japan — Nihon Superior Co. Ltd. will introduce a range newly developed products that offer solu- tions for some of the challenges the electronics industry is now facing: lead-free die attach, void minimiza- tion, environmental protection, and process yields. SN100C P810 D4 is a lead-free
solder paste that has been formulat- ed to minimize voiding by managing the release of volatiles during the reflow profile and minimizing sur- face tension to facilitate the escape of gas bubbles before the joint freezes. Bubble escape is also facilitated by the eutectic behavior of the SN100C alloy. While this formulation signifi-
cantly reduces voiding even in con- ventional reflow, voiding can be reduced to levels well below tight- ened industry targets if used in com- bination with vacuum reflow. Low voiding is becoming more important in joints, such as those to power devices that have to have maximum thermal as well as electrical conduc- tivity.
Alconano Nano-Silver Paste is
based on a patented technology that makes it possible to effect joints to most metals as well as Si and SiC at low sintering temperatures, in nitro- gen, if necessary, without the nitrous or sulfurous residues that are the by- products of the sintering of some
other nano-silver pastes. The highly active surface of the nano-silver par- ticles and the consequent strong cap- illary forces make it possible to achieve strong bonds with high elec- trical and thermal conductivity at low temperature without the need for external pressure. By controlling the sintered
microstructure, the modulus of
the joint can be tailored to accommo- date strains arising from CTE differ- ences between a die and a substrate without overstressing the die. After sintering, the melting point of the sil- ver returns to the 961.8°C of bulk sil- ver so that the joint retains its integrity at high operating tempera-
tures. As such it is well suited to the attachment of power semiconductor die that can achieve maximum effi- ciency at higher operating tempera- tures. The Alconano nano-silver
Lead-free solder paste.
pastes can thus can be considered a Pb-free replacement for the >85 per- cent Pb solders that are currently used in this application. SN100C7A is a lead-free solder
NEW! DS2000 Digital Oscilloscopes
for use in applications such as power modules that have to operate at high temperatures. The high volume frac- tion of intermetallic particles with controlled morphology means that the material retains adequate strength at temperatures above its
227° C solidus temperature. Contact: Nihon Superior Co.,
Ltd. Overseas Sales Section NS Bldg., 1-16-15 Esaka-Cho, Suita
City, Osaka, 564-0063 Japan % +81-(0)6-6380-1121 fax: +81-(0)6-6380-1262 Web site:
www.nihonsuperior.co.jp/english
See at IPC/APEX Booth #833.
EasyBraid Intros X-Ray Inspection System
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839 X-ray inspection system.
er of SEC X-ray Systems, and are adding this machine to its already extensive product line. According to the company, SEC’s successful AXI solutions will help to meet the con- stant and rigorous challenges of the
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K-Tel Drive, Minneapolis, MN 55343 % 800-840-5394 or 952-929- 3040 fax: 952-929-2765 E-mail:
info@easybraidco.com Web:
www.easybraidco.com
See at IPC/APEX Booth #1527.
Minneapolis, MN — EasyBraid Co. is introducing the SEC X-eye 6200 X-ray Inspection System, the latest offering in SEC’s 2D and 3D/CT X-ray product line. The X-eye 6200 AXI is an innova- tive and robust in-line AXI system with high inspection speeds of up to 2.5 seconds per BGA. The X-eye is available in both 2D and 3D versions which make it a versatile machine for limitless applications. EasyBraid is the exclusive North American suppli-
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