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www.us-tech.com Continued from page 60
of sample parts with point and click ease. Operators no longer have to understand x-ray physics and basic technique factors because inspection routines are stored on the local com- puter or on a network drive. By adding an Internet connection, engi- neers have the tools available for quick consultation with managers and engineers worldwide; the x-ray system operating screen along with the imaging results is displayed on all of the attendee’s desktops. Do you have an issue with your
product and want to know if x-ray imaging could solve your problem? Here is a quick overview of just a few of the often overlooked applications for using x-ray imaging. Parts, Presence, Placement. Use this if you are building a complex assembly and want to insure that all of the parts are present and are func- tioning as designed. This type of x-ray imaging is also popular for battery inspection; batteries can be inspected for standoff spacing and potential shorts. When this method is combined with automated x-ray inspection, 100 percent inspection is easily achieved. Typical users would be medical
Any x-ray system can be used to detect
counterfeit components; all you need is to have a known good sample.
device manufacturers, electro-mech - anical/switch manufacturers, manu- facturers of subassemblies, and auto- motive component suppliers. Resistance Welds. This application
February, 2013 You Only Think You Don’t Need X-Ray Imaging
is used for inspecting plastic parts/ tubing and smaller thin-walled metal parts/tubing as well as resistance welds of electrical connections.
inspection. PCB manufacturers would use x-ray to confirm the inner layer registration before drilling through holes. IC and Component Inspection. This application is used primarily by IC manufacturers and component manufacturers. Standard uses would be wire sweep, die attach voiding, capacitor insulation and voiding in resistor packs. Any x-ray system can be used
X-ray image of battery shows placement of internal components.
Aluminum Die Casting. This application applies to smaller die castings; items that can be effective- ly examined usually weigh less than 3 pounds (1.4 kilos). This is because of the small focal spot power limita- tion that most electronic x-ray inspection systems use. Shrinkage, inclusions and porosity can be imaged down to the 5 to 7µ range. Plastic Molding. This application applies to plastic moldings up to 3 pounds. Cracks, voiding and inclu- sions can be detected in molded parts down to the 5 to 7µ range. Solder Joint Quality. This applica- tion is used mainly in the PCB and surface mount industries; it is well known and requires very little expla- nation. Standard uses are BGA inspection, µBGA and flip chip
for detection of counterfeit compo- nents; all you would need to do a counterfeit component inspection is to have a known good sample. Counterfeit components can be iden- tified by the x-ray signature or the overall density of the sample compo- nent. End users of ICs and compo- nents would use x-ray to confirm the quality/authenticity of the incoming components.
Incoming Parts Inspection As in counterfeit component
inspection, incoming inspection can be performed on subassemblies and components such as printed circuit boards, drill offset can be quickly ver- ified and documented by using x-ray imaging.
Over-molded and encapsulated
medical devices present a difficult challenge when investigating process issues or returns from the field. This is due to the nature of their design. Visual inspection and electrical tests provide very little information as to why the assembly failed internally. Destructive testing is a viable
alternative to visual and electrical tests but often destroys the assembly and can easily obliterate or mask the actual component failure cause. If the intent is to repair the assembly
and return it to the customer, the process of quoting the repair can become much more costly if only visual and electrical test modes are used in the evaluation and repair. X-Ray Imaging has solved these
problems for numerous medical device manufacturers and automo- tive component manufacturers by
X-ray image of spring-loaded probes.
allowing the operator to quickly inspect and document an assembly and make an informed decision in the control of a process or repair of the assembly.
Repairs Made Easier One medical device manufac-
turer was doing a visual inspection and electrical test before quoting the customer on the repair of a very expensive encapsulated assembly. By using the x-ray system for initial inspection, the company was able to reduce its labor costs in the evalua- tion phase and provide the customer with a faster and more accurate repair quote. Another medical device manu-
facturer was visually inspecting over- molded components and using a time- consuming process of painstakingly
Continued on page 65
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